Head-mounted display systems
    2.
    发明授权

    公开(公告)号:US11927761B1

    公开(公告)日:2024-03-12

    申请号:US17346059

    申请日:2021-06-11

    Applicant: Apple Inc.

    Abstract: A head-mounted device may have a head-mounted housing. The head-mounted housing may have rear-facing display that displays a three-dimensional image to rear eye boxes. The head-mounted device may also have a front-facing display that faces away from the rear eye boxes. The front-facing display may cover a front face of the head-mounted housing. To share content such as content being displayed by the rear-facing displays with external viewers, the head-mounted device may use the front-facing display or a separate display to display images. An accessory that is coupled to the front face of the housing may reflect an image on the front-facing display towards a viewer for viewing. Sensors in the device may detect presence of the accessory. Display projectors and waveguides or optical layers on the front face that overlap the front-facing display may be used to display three-dimensional images to front eye boxes.

    Electronic devices with stacked circuitry

    公开(公告)号:US11871517B1

    公开(公告)日:2024-01-09

    申请号:US17200608

    申请日:2021-03-12

    Applicant: Apple Inc.

    CPC classification number: H05K1/147 H05K1/189 H05K2201/10128

    Abstract: An electronic device may have a display with an array of pixels for displaying images. The electronic device may also have a lens through which the images are viewable on the display. The display may have a display panel that is mounted to a printed circuit stack. The printed circuit stack may include multiple printed circuit layers to which components are mounted. The components may include an orientation sensor overlapped by the display panel. A camera may be mounted to a printed circuit stack and may overlap one or more electrical components such as an orientation sensor. The printed circuit stacks may include rigid and flexible printed circuits coupled together using solder and other conductive connections. Air gaps may be created between stacked printed circuit layers.

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