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公开(公告)号：US20190089042A1
公开(公告)日：2019-03-21
申请号：US15709632
申请日：2017-09-20
Applicant: APTIV TECHNOLOGIES LIMITED.
Inventor： George J. Purden , Shawn Shi , David W. Zimmerman
Abstract: An illustrative example transmission device, which is useful for an automated vehicle, includes a substrate having a metal layer near one surface of the substrate and a waveguide area. The metal layer includes a slot that at least partially overlaps the waveguide area. A source of radiation includes a first radiation output situated on a first side of the slot and a second radiation output situated on a second, opposite side of the slot.
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公开(公告)号：US10468738B2
公开(公告)日：2019-11-05
申请号：US15070059
申请日：2016-03-15
Applicant: APTIV TECHNOLOGIES LIMITED
Inventor： George J. Purden , Shawn Shi
Abstract: An illustrative example electronic device includes a substrate integrated wave guide (SIW) comprising a substrate and a plurality of conductive members in the substrate. An antenna member is situated at least partially in the substrate in a vicinity of at least some of the plurality of conductive members. A signal generator has a conductive output electrically coupled with the antenna member. The antenna member radiates a signal into the SIW based on operation of the signal generator.
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公开(公告)号：US11145961B2
公开(公告)日：2021-10-12
申请号：US16671247
申请日：2019-11-01
Applicant: APTIV TECHNOLOGIES LIMITED
Inventor： George J. Purden , Shawn Shi
IPC: H01Q1/32 , H01P5/103 , H01P11/00 , H01L23/00 , H01L23/66 , H01P3/12 , H01Q1/22 , H01P5/107 , H01Q1/50 , H01Q3/34
Abstract: An illustrative example electronic device includes a substrate integrated wave guide (SIW) comprising a substrate and a plurality of conductive members in the substrate. An antenna member is situated at least partially in the substrate in a vicinity of at least some of the plurality of conductive members. A signal generator has a conductive output electrically coupled with the antenna member. The antenna member radiates a signal into the SIW based on operation of the signal generator.
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Patent Agency Ranking
公开(公告)号：US11139581B2
公开(公告)日：2021-10-05
申请号：US16295285
申请日：2019-03-07
Applicant: Aptiv Technologies Limited
Inventor： Jun Yao , George J. Purden , Ryan K. Rossiter
Abstract: An illustrative example electronic device includes a signal generator having at least one conductive output member. A substrate integrated waveguide (SIW) includes a substrate and a plurality of conductive members in the substrate. The substrate includes a slot in one exterior surface of the substrate. The slot is situated adjacent the at least one conductive output member of the signal generator such that a signal of the signal generator is coupled into the SIW through the slot.
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公开(公告)号：US11183751B2
公开(公告)日：2021-11-23
申请号：US15709632
申请日：2017-09-20
Applicant: APTIV TECHNOLOGIES LIMITED
Inventor： George J. Purden , Shawn Shi , David W. Zimmerman
Abstract: An illustrative example transmission device, which is useful for an automated vehicle, includes a substrate having a metal layer near one surface of the substrate and a waveguide area. The metal layer includes a slot that at least partially overlaps the waveguide area. A source of radiation includes a first radiation output situated on a first side of the slot and a second radiation output situated on a second, opposite side of the slot.
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6.发明申请公开(公告)号：US20200287290A1
公开(公告)日：2020-09-10
申请号：US16295285
申请日：2019-03-07
Applicant: Aptiv Technologies Limited
Inventor： Jun Yao , George J. Purden , Ryan K. Rossiter
Abstract: An illustrative example electronic device includes a signal generator having at least one conductive output member. A substrate integrated waveguide (SIW) includes a substrate and a plurality of conductive members in the substrate. The substrate includes a slot in one exterior surface of the substrate. The slot is situated adjacent the at least one conductive output member of the signal generator such that a signal of the signal generator is coupled into the SIW through the slot.
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公开(公告)号：US10680305B2
公开(公告)日：2020-06-09
申请号：US15934126
申请日：2018-03-23
Applicant: Aptiv Technologies Limited
Inventor： Alireza Foroozesh , George J. Purden , Shawn Shi
Abstract: A signal handling device includes a first substrate. A plurality of first conductors in the first substrate are arranged to form a substrate integrated waveguide. A second substrate includes a plurality of second conductors arranged to form a resonating cavity near one end of the substrate integrated waveguide. A signal carrier is aligned with the one end of the substrate integrated waveguide.
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公开(公告)号：US10199707B2
公开(公告)日：2019-02-05
申请号：US15292824
申请日：2016-10-13
Applicant: Aptiv Technologies Limited
Inventor： George J. Purden , Shawn Shi , David W. Zimmerman
IPC: H01P5/08 , H01L23/498 , H01L23/66 , H01L23/00 , H01P3/10 , H05K1/02 , H05K1/11 , H01P3/12 , H01P5/107
Abstract: A ball-grid-array printed-circuit-board assembly includes a die, a plurality of solder-balls, a substrate, a top-metal layer, and a bottom-metal layer. The die includes a signal-out-pad and a plurality of ground-pads arranged about the signal-out-pad. The top-metal layer, a plurality of vias in the substrate, and the bottom-metal layer cooperate to form a substrate-integrated-waveguide. The top-metal layer is configured to define a U-shaped-slot between a signal-portion of the top-metal layer aligned with the signal-out-pad and the substrate-integrated-waveguide, and a ground-portion of the top-metal layer aligned with the plurality of ground-pads. The U-shaped-slot is characterized by a slot-length that is selected based on the frequency of a signal, and a slot-width that is selected based on the via-height such that the signal generates an electric field directed across the U-shaped-slot whereby the signal is propagated from the signal-portion of the top-metal layer into the substrate-integrated-waveguide.
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