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公开(公告)号：US11315852B2
公开(公告)日：2022-04-26
申请号：US16599712
申请日：2019-10-11
Applicant: APTIV TECHNOLOGIES LIMITED
Inventor： Scott D. Brandenburg , David W. Zimmerman
IPC: H01L23/373 , H01L23/367 , H05K7/20
Abstract: An electronic device includes a printed circuit board that supports an integrated circuit (IC) chip and a thermal interface layer that is configured to transfer thermal energy from the IC chip. The thermal interface layer includes a containment frame that is non-electrically conductive and a thermal conductance pane that is inset in the containment frame.
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公开(公告)号：US11121058B2
公开(公告)日：2021-09-14
申请号：US16520862
申请日：2019-07-24
Applicant: Aptiv Technologies Limited
Inventor： Scott D. Brandenburg , David W. Zimmerman
IPC: H01L23/427 , H01L23/373 , H01L23/42 , H01L23/04 , H01L23/29 , H01L23/473 , H01L21/48 , H05K1/02 , H05K1/18 , H01L23/498
Abstract: An electronic device includes a printed circuit board (PCB) that supports an integrated circuit (IC) chip. The device also includes a lid over the IC chip. A thermal interface material (TIM) is configured to transfer thermal energy from the IC chip to the lid. A heat spreader forms a cavity in communication with the lid. The heat spreader is at least partially filled with a liquid that is configured to change phases during operation of the IC chip.
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公开(公告)号：US11095014B2
公开(公告)日：2021-08-17
申请号：US16735884
申请日：2020-01-07
Applicant: Aptiv Technologies Limited
Inventor： Scott D. Brandenburg , David W. Zimmerman , Shawn Shi
Abstract: An illustrative example embodiment of an antenna device includes a substrate, a plurality of antenna elements supported on the substrate, an integrated circuit supported on one side of the substrate, and a metallic waveguide antenna situated against the substrate. The metallic waveguide antenna includes a heat dissipation portion in a thermally conductive relationship with the integrated circuit. The heat dissipation portion is configured to reduce a temperature of the integrated circuit.
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公开(公告)号：US11509035B2
公开(公告)日：2022-11-22
申请号：US17375145
申请日：2021-07-14
Applicant: Aptiv Technologies Limited
Inventor： Scott D. Brandenburg , David W. Zimmerman , Shawn Shi
Abstract: An illustrative example embodiment of an antenna device includes a substrate, a plurality of antenna elements supported on the substrate, an integrated circuit supported on one side of the substrate, and a metallic waveguide antenna situated against the substrate. The metallic waveguide antenna includes a heat dissipation portion in a thermally conductive relationship with the integrated circuit. The heat dissipation portion is configured to reduce a temperature of the integrated circuit.
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公开(公告)号：US20220271437A1
公开(公告)日：2022-08-25
申请号：US17663163
申请日：2022-05-12
Applicant: Aptiv Technologies Limited
Inventor： Scott D. Brandenburg , Mark W. Hudson , David W. Zimmerman
Abstract: This document describes techniques and apparatuses for a plastic air-waveguide antenna with conductive particles. The described antenna includes an antenna body made from a resin embedded with conductive particles, a surface of the antenna body that includes a resin layer with no or fewer conductive particles, and a waveguide structure. The waveguide structure can be made from a portion of the surface on which the embedded conductive particles are exposed. The waveguide structure can be molded as part of the antenna body or cut into the antenna body using a laser, which also exposes the conductive particles. If the waveguide is molded as part of the antenna body, the conductive particles can be exposed by an etching process or by using the laser. In this way, the described apparatuses and techniques can reduce weight, improve gain and phase control, improve high-temperature performance, and avoid at least some vapor-deposition plating operations.
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Patent Agency Ranking
公开(公告)号：US20210375718A1
公开(公告)日：2021-12-02
申请号：US17403632
申请日：2021-08-16
Applicant: Aptiv Technologies Limited
Inventor： Scott D. Brandenburg , David W. Zimmerman
IPC: H01L23/427 , H01L23/373 , H01L23/42 , H01L23/04 , H01L23/29 , H01L23/473 , H01L21/48 , H05K1/02 , H05K1/18 , H01L23/498
Abstract: An electronic device includes a printed circuit board (PCB) that supports an integrated circuit (IC) chip. The device also includes a lid over the IC chip. A thermal interface material (TIM) is configured to transfer thermal energy from the IC chip to the lid. A heat spreader forms a cavity in communication with the lid. The heat spreader is at least partially filled with a liquid that is configured to change phases during operation of the IC chip.
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公开(公告)号：US20190089042A1
公开(公告)日：2019-03-21
申请号：US15709632
申请日：2017-09-20
Applicant: APTIV TECHNOLOGIES LIMITED.
Inventor： George J. Purden , Shawn Shi , David W. Zimmerman
Abstract: An illustrative example transmission device, which is useful for an automated vehicle, includes a substrate having a metal layer near one surface of the substrate and a waveguide area. The metal layer includes a slot that at least partially overlaps the waveguide area. A source of radiation includes a first radiation output situated on a first side of the slot and a second radiation output situated on a second, opposite side of the slot.
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公开(公告)号：US11626345B2
公开(公告)日：2023-04-11
申请号：US17403632
申请日：2021-08-16
Applicant: Aptiv Technologies Limited
Inventor： Scott D. Brandenburg , David W. Zimmerman
IPC: H01L23/427 , H01L23/373 , H01L23/42 , H01L23/04 , H01L23/29 , H01L23/473 , H01L21/48 , H05K1/02 , H05K1/18 , H01L23/498
Abstract: An electronic device includes a printed circuit board (PCB) that supports an integrated circuit (IC) chip. The device also includes a lid over the IC chip. A thermal interface material (TIM) is configured to transfer thermal energy from the IC chip to the lid. A heat spreader forms a cavity in communication with the lid. The heat spreader is at least partially filled with a liquid that is configured to change phases during operation of the IC chip.
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公开(公告)号：US20220248525A1
公开(公告)日：2022-08-04
申请号：US17217511
申请日：2021-03-30
Applicant: APTIV TECHNOLOGIES LIMITED
Inventor： Scott D. Brandenburg , David W. Zimmerman , Navneet Gupta
IPC: H05K1/02 , H01L23/552 , H01L23/367 , H05K1/18 , H05K3/30 , H05K9/00 , H05K7/20 , G01S7/02 , G01S13/931
Abstract: An electromagnetic interference (EMI) shielding and thermal management system, method, and automotive radar system for an integrated circuit of a product circuit board (PCB) of a radar sensor includes a shield member disposed above the integrated circuit and extending to unpopulated areas of the PCB and configured to shield the integrated circuit from EMI and transfer heat energy generated by the integrated circuit away from the integrated circuit, and a set of pin members configured to be inserted through respective apertures defined by the shield member and the PCB and configured to transfer the heat energy from the shield member to an environment external to the PCB.
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公开(公告)号：US20220109247A1
公开(公告)日：2022-04-07
申请号：US17061675
申请日：2020-10-02
Applicant: Aptiv Technologies Limited
Inventor： Scott D. Brandenburg , Mark W. Hudson , David W. Zimmerman
Abstract: This document describes techniques and apparatuses for a plastic air-waveguide antenna with conductive particles. The described antenna includes an antenna body made from a resin embedded with conductive particles, a surface of the antenna body that includes a resin layer with no or fewer conductive particles, and a waveguide structure. The waveguide structure can be made from a portion of the surface on which the embedded conductive particles are exposed. The waveguide structure can be molded as part of the antenna body or cut into the antenna body using a laser, which also exposes the conductive particles. If the waveguide is molded as part of the antenna body, the conductive particles can be exposed by an etching process or by using the laser. In this way, the described apparatuses and techniques can reduce weight, improve gain and phase control, improve high-temperature performance, and avoid at least some vapor-deposition plating operations.
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