公开(公告)号：US20230340380A1

公开(公告)日：2023-10-26

申请号：US18041214

申请日：2021-08-05

Applicant: ASAHI KASEI KABUSHIKI KAISHA

Inventor： Yohei NOBE ,  Takafumi IWAI ,  Shigeru ENDO

IPC: C11D11/00 ,  C11D3/37 ,  C11D1/86 ,  B08B9/032 ,  B29C48/27 ,  B29C45/17

CPC classification number: C11D11/0041 ,  C11D3/3715 ,  C11D3/3769 ,  C11D3/3749 ,  C11D1/86 ,  B08B9/0321 ,  B29C48/27 ,  B29C45/1753 ,  C11D1/667

Abstract: A purging compound for removing a processing residue comprising a resin (C) to be purged, from a resin processing machine, comprising: a thermoplastic resin (A) and a non-ionic additive (B) of the following Formula (I) having a melting or softening point of lower than 150° C.:


Rn—X   (I)

(where R is a hydrophobic organic group, n is an integer of 1 or more, and X is a polar group), wherein a MFR (280° C. and a load of 2.16 kg) is 30 g/10 min or less, the difference of the solubility parameter between the resin (A) and the resin (C) is +1.6 to −1.6 (cal/cm3)1/2, the difference of the solubility parameter between the additive (B) and the resin (C) is +1.6 to −1.6 (cal/cm3)1/2, and the difference of the solubility parameter between the additive (B) and the hydrophobic organic group R is 0.7 (cal/cm3)1/2 or more.

公开(公告)号：US20230295403A1

公开(公告)日：2023-09-21

申请号：US18185369

申请日：2023-03-17

Applicant: ASAHI KASEI KABUSHIKI KAISHA

Inventor： Yohei NOBE ,  Takafumi IWAI ,  Shunichiro I ,  Shigeru ENDO

IPC: C08L23/06 ,  C08L23/12 ,  C08L25/06

CPC classification number: C08L23/06 ,  C08L23/12 ,  C08L25/06

Abstract: [Problem] An object of the present disclosure is to provide a new purging compound for a resin processing machine made from a resin derived from a biomass raw material which reduces the environmental load, and has a purging performance comparable to those of conventional purging compounds for a resin processing machine. [Solution] A purging compound for a resin processing machine contains 10 to 97% by mass of a resin having a bio degree of 30% or more with respect to 100% by mass of the purging compound, wherein the resin has a weight average molecular weight of 200,000 or more and 1,500,000 or less, and a ratio of the weight average molecular weight to the number average molecular weight (Mw/Mn) of 8 or less.