公开(公告)号：US3703668A

公开(公告)日：1972-11-21

申请号：US3703668D

申请日：1971-07-09

Applicant: ASEA AB

Inventor： BYLUND PER-AKE ,  FARKAS TIBOR ,  ANDERSSON NILS ERIC

IPC: H01L23/473 ,  H01L25/03 ,  H01L3/00 ,  H01L5/00

CPC classification number: H01L23/473 ,  H01L25/03 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A semiconductor device comprises semiconductor elements arranged side by side and provided with hollow cooling bodies. The cooling bodies are joined to each other by a connection conduit for the coolant which is flexible and which insulates the cooling bodies from each other electrically. The connection conduit comprises a tube of insulating inorganic material and a bellows of metallic material fixed to each end of the tube.

Abstract translation: 半导体器件包括并排布置的半导体元件，并且设置有中空冷却体。 冷却体通过用于冷却剂的连接管道彼此连接，冷却剂是柔性的并且使冷却体彼此电绝缘。 连接管道包括绝缘无机材料管和固定到管的每个端部的金属材料的波纹管。