公开(公告)号：US3649738A

公开(公告)日：1972-03-14

申请号：US3649738D

申请日：1971-02-16

Applicant: ASEA AB

Inventor： ANDERSSON NILS ERIC ,  FARKAS TIBOR

IPC: H01L23/36 ,  H01L23/049 ,  H01L23/051 ,  H01L23/467 ,  H01L23/473 ,  H01L1/12

CPC classification number: H01L23/473 ,  H01L23/049 ,  H01L23/051 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/01079 ,  H01L2924/00

Abstract: A semiconductor system including a semiconductor wafer is provided on at least one side with cooling means formed of a container having a movable wall facing the semiconductor system into which a cooling fluid is fed in such a way as to maintain a substantial pressure in the container to press the movable wall against the semiconductor device.

Abstract translation: 包括半导体晶片的半导体系统在至少一侧上设置有冷却装置，该冷却装置由容器形成，该容器具有面向半导体系统的可移动壁，冷却流体以这样一种方式供入，以便将容器中的实质压力维持在 将可移动的壁压靠在半导体器件上。

公开(公告)号：US3703668A

公开(公告)日：1972-11-21

申请号：US3703668D

申请日：1971-07-09

Applicant: ASEA AB

Inventor： BYLUND PER-AKE ,  FARKAS TIBOR ,  ANDERSSON NILS ERIC

IPC: H01L23/473 ,  H01L25/03 ,  H01L3/00 ,  H01L5/00

CPC classification number: H01L23/473 ,  H01L25/03 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A semiconductor device comprises semiconductor elements arranged side by side and provided with hollow cooling bodies. The cooling bodies are joined to each other by a connection conduit for the coolant which is flexible and which insulates the cooling bodies from each other electrically. The connection conduit comprises a tube of insulating inorganic material and a bellows of metallic material fixed to each end of the tube.

Abstract translation: 半导体器件包括并排布置的半导体元件，并且设置有中空冷却体。 冷却体通过用于冷却剂的连接管道彼此连接，冷却剂是柔性的并且使冷却体彼此电绝缘。 连接管道包括绝缘无机材料管和固定到管的每个端部的金属材料的波纹管。