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公开(公告)号：US20180184555A1
公开(公告)日：2018-06-28
申请号：US15845430
申请日：2017-12-18
发明人： Thomas ROSSMANN , Stefan SEITZ , Norbert HEILMANN , Johannes JUSTINGER , Stefan MAGG , Stefan GEIGER
CPC分类号： H05K13/028 , B65B15/04 , B65B25/00 , B65B57/06 , B65G65/005 , B65G65/23 , B65G65/32 , B65G2201/047 , H05K13/0084 , H05K13/021
摘要： A magazine (200) is described for portion-wise receiving individualized bulk electronic components (298). The magazine (200) comprises (a) a receiving structure (110) which comprises multiple closable receiving cavities (112, 112a), which are arranged along a longitudinal axis (100a) of the receiving structure (110); (b) a cover structure (120) which is arranged at an upper side of the receiving structure (110), displaceable along the longitudinal axis (100a), so that in a closed position of the cover structure (120) all receiving cavities (112, 112a) are covered and in one opening position of multiple opening positions at least one receiving cavity (112) is free; and (c) a closure foil (225) which encompasses the cover structure (120) along the longitudinal axis (100a) in the form of a closed tape, wherein at least a part of the closure foil (225) is releasably connected to the receiving structure (110). Further, a device (430) is described for portion-wise transferring components (298) from one such magazine (200) into a reservoir (490) for a component supply device. Further, a method is described for portion-wise transferring components from one such magazine (200) into the one such reservoir (490).
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公开(公告)号：US20200170153A1
公开(公告)日：2020-05-28
申请号：US16776616
申请日：2020-01-30
发明人： Thomas ROSSMANN , Stefan SEITZ , Norbert HEILMANN , Johannes JUSTINGER , Stefan MAGG , Stefan GEIGER
IPC分类号： H05K13/02 , B65G65/32 , B65G65/23 , B65G65/00 , B65B15/04 , H05K13/00 , B65B25/00 , B65B57/06
摘要： A magazine (200) is described for portion-wise receiving individualized bulk electronic components (298). The magazine (200) comprises (a) a receiving structure (110) which comprises multiple closable receiving cavities (112, 112a), which are arranged along a longitudinal axis (100a) of the receiving structure (110); (b) a cover structure (120) which is arranged at an upper side of the receiving structure (110), displaceable along the longitudinal axis (100a), so that in a closed position of the cover structure (120) all receiving cavities (112, 112a) are covered and in one opening position of multiple opening positions at least one receiving cavity (112) is free; and (c) a closure foil (225) which encompasses the cover structure (120) along the longitudinal axis (100a) in the form of a closed tape, wherein at least a part of the closure foil (225) is releasably connected to the receiving structure (110). Further, a device (430) is described for portion-wise transferring components (298) from one such magazine (200) into a reservoir (490) for a component supply device. Further, a method is described for portion-wise transferring components from one such magazine (200) into the one such reservoir (490).
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3.发明申请公开(公告)号：US20150237309A1
公开(公告)日：2015-08-20
申请号：US14616815
申请日：2015-02-09
发明人： Norbert HEILMANN
CPC分类号： H04N7/18 , G06K9/52 , H04N5/2258 , H05K13/046 , H05K13/0812
摘要： A method for mounting an electronic component (180) onto a component carrier (179) is described. The method comprises (a) optically capturing a first image from a first side of the component (180), at which first side a first structural feature (185) of the component (180) is discernible, by means of a first camera (120), (b) optically capturing a second image from a second side of the component (180), at which second side a second structural feature (186) of the component (180) is discernible, by means of a second camera (160), wherein the first side and the second side are situated opposite one another and wherein the second structural feature (186) is configured to be connected at a predetermined position on the component carrier (175), (c) orienting the electronic component (180) such that a center of the first structural feature (185) is aligned with a desired position relative to the component carrier (175), wherein the second structural feature (186) can be correspondingly offset from the predetermined position, and (d) mounting the electronic component (180) onto the component carrier (175), wherein the center of the first structural feature (185) is aligned relative to the component carrier (175), wherein the second structural feature (186) is offset from the predetermined position. Moreover, a method for checking the functionality of an optoelectronic component in advance of a population of a component carrier and an automatic placement machine for mounting an optically measured electronic component are also described.
摘要翻译： 描述了将电子部件（180）安装到部件载体（179）上的方法。 该方法包括：（a）从部件（180）的第一侧光学捕获第一图像，第一侧通过第一相机（120）识别部件（180）的第一结构特征（185） ），（b）通过第二相机（160）从组件（180）的第二侧光学地捕获第二图像，在该第二侧，组件（180）的第二结构特征（186）可识别的第二侧， ，其中所述第一侧和所述第二侧彼此相对定位，并且其中所述第二结构特征（186）构造成连接在所述分量载体（175）上的预定位置处，（c）使所述电子部件（180） 使得第一结构特征（185）的中心与相对于分量载体（175）的期望位置对准，其中第二结构特征（186）可以相应地从预定位置偏移，以及（d）将 电子元件（180）到组件上 （175），其中所述第一结构特征（185）的中心相对于所述分量载体（175）对准，其中所述第二结构特征（186）从所述预定位置偏移。 此外，还描述了用于检查组件载体和用于安装光学测量的电子部件的自动放置机之前的光电子部件的功能性的方法。
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