公开(公告)号：US20240317450A1

公开(公告)日：2024-09-26

申请号：US18735020

申请日：2024-06-05

申请人： STMICROELECTRONICS S.r.l.

发明人： Massimiliano PESATURO ,  Massimo GREPPI

IPC分类号： B65D1/36 ,  B65D85/68 ,  H05K13/00

CPC分类号： B65D1/36 ,  B65D85/68 ,  H05K13/0084 ,  B65D2585/86

摘要： Tray for containing electronic components formed by a bearing body, substantially planar, having a first and a second face. First holding structures extend from the first face of the bearing body and second holding structures extend from the second face of the bearing body. Each second holding structure is aligned with a respective first holding structure in a vertical direction perpendicular to the first and the second faces of the bearing body. Each first holding structure is formed by first protrusions mutually spaced by first spaces and arranged along a first closed line; each second holding structure is formed by second protrusions mutually spaced by second spaces and arranged along a second closed line. Each second protrusion is aligned, in parallel with the vertical direction, with the first spaces and each first protrusion is aligned, in parallel with the vertical direction, with the second spaces.

公开(公告)号：US20240237320A1

公开(公告)日：2024-07-11

申请号：US18617692

申请日：2024-03-27

申请人： Murata Manufacturing Co., Ltd.

发明人： Kiyoyuki NAKAGAWA

IPC分类号： H05K13/00 ,  B65D25/30 ,  B65D25/52

CPC分类号： H05K13/0084 ,  B65D25/30 ,  B65D25/52

摘要： An electronic component container includes a component accommodating space to accommodate electronic components, and a discharge port through which the electronic components accommodated in the component accommodating space are dischargeable to an outside. An inner wall surface of the component accommodating space has a skewness Rsk of about −0.8 or greater and about −0.3 or less.

公开(公告)号：US20240206141A1

公开(公告)日：2024-06-20

申请号：US18591110

申请日：2024-02-29

申请人： Panasonic Intellectual Property Management Co., Ltd.

发明人： Tetsushi OHORI ,  Takashi UCHINO ,  Hiroki YAMAMOTO

IPC分类号： H05K13/00 ,  B66F9/06 ,  G05B19/418

CPC分类号： H05K13/0084 ,  B66F9/063 ,  G05B19/41865 ,  H05K13/0015 ,  G05B2219/50393

摘要： A work system includes a mounting system which mounts a component on a board and an unmanned conveyance system having an unmanned conveyance vehicle. The unmanned conveyance system includes a first notifier which notifies the mounting system of an arrival notification indicating that the unmanned conveyance vehicle transfers the feeder carriage to a position where an operation of connecting the feeder carriage to the base starts, and a first processor which causes the unmanned conveyance vehicle to travel in a direction away from the base upon receiving, from the mounting system, a connection completion indicating that a connection of the feeder carriage is completed. The mounting system includes a second processor which causes the connection mechanism to connect the feeder carriage upon receiving the arrival notification, and a second notifier which notifies the unmanned conveyance system of the connection completion upon being informed of completion of the connection.

公开(公告)号：US11997816B2

公开(公告)日：2024-05-28

申请号：US16945335

申请日：2020-07-31

申请人： Asys Automatisierungssysteme GmbH

发明人： Klaus Mang ,  Jurgen Lehner

IPC分类号： H05K7/14 ,  H05K13/00

CPC分类号： H05K7/1405 ,  H05K7/1421 ,  H05K13/0084

摘要： A substrate magazine for a substrate insertion system, having a frame in which several drawers for receiving in each case at least one flat substrate are arranged one above the other. Each drawer is formed by two guide rails, arranged in parallel and at a distance from one another at the same height as that of the frame, each with a sliding surface on which a substrate lying on the edge can be displaced. At least one elastically displaceable latching element is assigned to each drawer. In a first, unloaded state, the at least one latching element extends at least partially over the sliding surface of one of the guide rails of the drawer and, in a second, elastically deformed state, releases the sliding surface.

公开(公告)号：US11950369B2

公开(公告)日：2024-04-02

申请号：US17009165

申请日：2020-09-01

申请人： Panasonic Intellectual Property Management Co., Ltd.

发明人： Tetsushi Ohori ,  Takashi Uchino ,  Hiroki Yamamoto

IPC分类号： H05K13/00 ,  B66F9/06 ,  G05B19/418

CPC分类号： H05K13/0084 ,  B66F9/063 ,  G05B19/41865 ,  H05K13/0015 ,  G05B2219/50393

摘要： A work system includes a mounting system which mounts a component on a board and an unmanned conveyance system having an unmanned conveyance vehicle. The unmanned conveyance system includes a first notifier which notifies the mounting system of an arrival notification indicating that the unmanned conveyance vehicle arrives at a position where separating the feeder carriage from the base starts, and a first processor which causes the unmanned conveyance vehicle to travel in a direction away from the base upon receiving, from the mounting system, a release notification indicating that a connection of the feeder carriage is released. The mounting system includes a second processor which causes the connection mechanism to release the connection of the feeder carriage upon receiving the arrival notification, and a second notifier which notifies the unmanned conveyance system of the release notification upon being informed of completion of the release operation.

公开(公告)号：US20240098956A1

公开(公告)日：2024-03-21

申请号：US17948900

申请日：2022-09-20

申请人： Bahman Khoshnood ,  Harvey Bruce Altman ,  Brandon James Nolan

发明人： Bahman Khoshnood ,  Harvey Bruce Altman ,  Brandon James Nolan

IPC分类号： H05K13/00 ,  B65G1/137 ,  G06Q10/08 ,  G08B5/36 ,  H05K13/02

CPC分类号： H05K13/0084 ,  B65G1/1371 ,  G06Q10/087 ,  G08B5/36 ,  H05K13/021 ,  B65G2201/0232

摘要： Intelligent storage trays each hold SMT (Surface Mount Technology) reels of varying width without the need for separating dividers between the reels. An arrangement of light pipes within the tray pivot so that either one or multiple light pipes are pushed back to a closed position when an SMT reel is placed in the tray. Sensors detect movement of the light pipes allowing software to automatically assign a single SMT reel storage location to all of the light pipes that were moved by the SMT reel placement. Beacons on the tray indicate actions needed to take place and compression contacts on the tray communicate with the storage system software when the tray is placed and removed from a holder, such as a cart. Spring pins lock the tray into place within the holder allowing for ease of placement and removal.

公开(公告)号：US20230320052A1

公开(公告)日：2023-10-05

申请号：US18118178

申请日：2023-03-07

申请人： Murata Manufacturing Co., Ltd.

发明人： Tomofumi KOBAYASHI

IPC分类号： H05K13/00

CPC分类号： H05K13/0084 ,  H01G4/30

摘要： An electronic component package includes a base tape including recesses. On an inner surface of each of the recesses, a protrusion that can abut an electronic component inside of the recess is provided. The electronic component includes a multilayer body having a parallelepiped or substantially parallelepiped shape and an external electrode on each of two end surfaces of the multilayer body.

公开(公告)号：US11725120B2

公开(公告)日：2023-08-15

申请号：US16668914

申请日：2019-10-30

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Chen-Ming Kuo ,  Jing Ruei Lu ,  Pei-Haw Tsao

IPC分类号： H01L21/677 ,  C09J5/00 ,  H01L21/683 ,  C09J7/38 ,  C09J7/20 ,  H01L21/673 ,  H05K13/00

CPC分类号： C09J5/00 ,  C09J7/20 ,  C09J7/381 ,  H01L21/67333 ,  H01L21/6836 ,  C09J2203/326 ,  C09J2301/416 ,  C09J2301/502 ,  C09J2427/00 ,  H05K13/0084

摘要： The current disclosure describes carrier tape systems, which include a carrier tape including a plurality of pockets. Each pocket contains a semiconductor device adhered to a bottom surface of the pocket by an adhesive. In some embodiments, the adhesive is a reversible adhesive. Use of the adhesive reduces the likelihood the semiconductor device will be damaged due to movement of the semiconductor device in the pocket during shipment of the carrier tape. Methods of forming a semiconductor device carrier systems and methods of supplying semiconductor devices are also described.

公开(公告)号：US20190006251A1

公开(公告)日：2019-01-03

申请号：US15638704

申请日：2017-06-30

申请人： Intel Corporation

发明人： Bassam Ziadeh ,  John Lofgren ,  Santosh Pabba ,  Kevin Pounds ,  Alin Ila

IPC分类号： H01L23/13 ,  H01L23/31 ,  H01L23/00 ,  H05K13/00

CPC分类号： H01L23/13 ,  H01L21/6835 ,  H01L23/3121 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2221/68309 ,  H01L2221/68313 ,  H05K13/0084

摘要： A carrier medium for a semiconductor die includes a carrier tape with at least one pocket for the die to sit in and a selectively applied non-activated adhesive on the carrier tape.

公开(公告)号：US20180279519A1

公开(公告)日：2018-09-27

申请号：US15764764

申请日：2015-10-01

申请人： YAMAHA HATSUDOKI KABUSHIKI KAISHA

发明人： Kazuyoshi OYAMA ,  Kazuhiro NAGAO ,  Koji YAMAZUMI

IPC分类号： H05K13/02

CPC分类号： H05K13/02 ,  H05K13/00 ,  H05K13/0084 ,  H05K13/0215

摘要： A tape processing method of reusing an opened component supplying tape used in a tape feeder which conveys the component supplying tape provided with a carrier tape including a plurality of component storing portions and a cover tape toward a component take out position, the tape feeder being configured to open a cover tape and convey the component supplying tape. The method includes steps of: repairing the component supplying tape by closing an opened portion of the cover tape and fixing by a repair tape to be returned to a state in which the component storing portion is covered by the cover tape; and cutting the component supplying tape at a predetermined cut position far away toward a downstream side in the conveying direction from a position of a head component located at the most downstream side in the conveying direction.