公开(公告)号：US20230080970A1

公开(公告)日：2023-03-16

申请号：US17942277

申请日：2022-09-12

Applicant: ASM IP Holding B.V.

Inventor： YongJin Jeong ,  Juill Lee ,  DaeYoun Kim ,  HeeBum Chae

IPC: H01L21/68 ,  H01L21/67 ,  H01L21/687

Abstract: A substrate processing apparatus capable of solving a misalignment problem of chamber portions due to thermal deformation or a vacuum force during high-temperature processing includes a first plate; a second plate on the first plate; a position control unit configured to change a relative position of the second plate with respect to the first plate; and a support unit configured to permit movement of the second plate while supporting the second plate.