SUBSTRATE PROCESSING APPARATUS
    1.
    发明申请

    公开(公告)号:US20230080970A1

    公开(公告)日:2023-03-16

    申请号:US17942277

    申请日:2022-09-12

    Abstract: A substrate processing apparatus capable of solving a misalignment problem of chamber portions due to thermal deformation or a vacuum force during high-temperature processing includes a first plate; a second plate on the first plate; a position control unit configured to change a relative position of the second plate with respect to the first plate; and a support unit configured to permit movement of the second plate while supporting the second plate.

    SUBSTRATE PROCESSING DEVICE
    2.
    发明申请

    公开(公告)号:US20240377145A1

    公开(公告)日:2024-11-14

    申请号:US18654213

    申请日:2024-05-03

    Abstract: Disclosed is a heat shielding device which shields heat from a chamber wall to the outside by creating one or more gas insulating layers around a chamber heated to a high temperature, thereby reducing heat loss, power consumed when heating the chamber to a certain temperature, minimizing the effect of heat to another chamber and reducing safety problems such as burning of an operator.

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