公开(公告)号：US20240218560A1

公开(公告)日：2024-07-04

申请号：US18397635

申请日：2023-12-27

Applicant: ASM IP Holding B.V.

Inventor： Sandeep Ghosh ,  Robinson James ,  Caleb Miskin

IPC: C30B25/16 ,  C23C16/24 ,  C23C16/52 ,  C30B25/10 ,  C30B29/06 ,  G01B21/08 ,  H01L21/02

CPC classification number: C30B25/16 ,  C23C16/24 ,  C23C16/52 ,  C30B25/10 ,  C30B29/06 ,  G01B21/08 ,  H01L21/02532 ,  H01L21/02576 ,  H01L21/0262

Abstract: A semiconductor processing system includes a precursor delivery arrangement, a chamber arrangement, and a controller. The chamber arrangement is connected to the precursor delivery arrangement. The controller is operatively connected to the precursor delivery arrangement and the chamber arrangement, includes a processor disposed in communication with a memory, and is responsive to instructions recorded on the memory to acquire a baseline substrate thickness profile for a selected process recipe, determine a first temperature profile setting for depositing a first material layer at low pressure for the selected process recipe, determine a high-pressure thermal offset for the first temperature profile setting, apply the high-pressure thermal offset to the first temperature profile setting to determine a second temperature profile setting, seat a first substrate on the first substrate support within the chamber arrangement and flow a second material layer precursor via the precursor delivery arrangement over the first substrate at high pressure according to the selected process recipe using the second temperature profile setting.