公开(公告)号：US20240287679A1

公开(公告)日：2024-08-29

申请号：US18585313

申请日：2024-02-23

Applicant: ASM IP Holding B.V.

Inventor： Yongjin Jeong ,  Naoto Tsuji ,  ByeongPil Park ,  Yonjong Jeon

IPC: C23C16/46 ,  H01L21/67

CPC classification number: C23C16/46 ,  H01L21/67109

Abstract: A wafer processing apparatus may be presented. The apparatus may comprise a wafer support provided with a heater for supporting and heating the wafer, a chamber for enclosing and processing the wafer, a showerhead for letting gas in the chamber, a pumping port for removing gas from the chamber, a black wall with a substantially high emissivity provided to the chamber near the pumping port and configured to partly encircle the wafer support; and a white wall with a substantially low emissivity provided to the chamber on opposite side of the pumping port and configured to partly encircle the wafer support.