公开(公告)号：US20230071798A1

公开(公告)日：2023-03-09

申请号：US17892780

申请日：2022-08-22

Applicant: ASM IP Holding B.V.

Inventor： SungHoon Jun ,  ByeongPil Park

IPC: H01L21/67

Abstract: A top lid capable of minimizing thermal deformation when a substrate processing temperature increases includes a support for supporting the top lid, the support protruding integrally from one surface of the top lid.

公开(公告)号：US20240287679A1

公开(公告)日：2024-08-29

申请号：US18585313

申请日：2024-02-23

Applicant: ASM IP Holding B.V.

Inventor： Yongjin Jeong ,  Naoto Tsuji ,  ByeongPil Park ,  Yonjong Jeon

IPC: C23C16/46 ,  H01L21/67

CPC classification number: C23C16/46 ,  H01L21/67109

Abstract: A wafer processing apparatus may be presented. The apparatus may comprise a wafer support provided with a heater for supporting and heating the wafer, a chamber for enclosing and processing the wafer, a showerhead for letting gas in the chamber, a pumping port for removing gas from the chamber, a black wall with a substantially high emissivity provided to the chamber near the pumping port and configured to partly encircle the wafer support; and a white wall with a substantially low emissivity provided to the chamber on opposite side of the pumping port and configured to partly encircle the wafer support.

公开(公告)号：US20230323558A1

公开(公告)日：2023-10-12

申请号：US18123508

申请日：2023-03-20

Applicant: ASM IP Holding B.V.

Inventor： SungHoon Jun ,  ByeongPil Park ,  Shinya Ueda

IPC: C25D11/18 ,  C23C16/46 ,  H01J37/32

CPC classification number: C25D11/18 ,  C23C16/463 ,  H01J37/32724

Abstract: A method of manufacturing a cooling device of a substrate processing apparatus includes: providing an aluminum plate having a through hole; forming a temperature control portion by anodizing the aluminum plate; and arranging the temperature control portion below a substrate support portion, wherein the temperature control portion is arranged so that a support rod of the substrate support portion passes through the through hole.