公开(公告)号：US20170168312A1

公开(公告)日：2017-06-15

申请号：US15370931

申请日：2016-12-06

Applicant: ASML HOLDING N.V.

Inventor： Parag Vinayak KELKAR

IPC: G02B27/28 ,  G03F7/20 ,  G02B27/14

Abstract: A method is disclosed that includes splitting a beam of radiation into a first part of the beam having a first polarization and a second part of the beam having a second polarization, forming a first beam with a first polarization distribution between the first polarization and the second polarization and/or a first intensity distribution by modulating the first part of the beam, forming a second beam with a second polarization distribution between the first polarization and the second polarization and/or a second intensity distribution by modulating the second part of the beam, and combining at least a portion of the first beam having the second polarization and at least a portion of the second beam having the first polarization.

公开(公告)号：US20200271438A1

公开(公告)日：2020-08-27

申请号：US16650962

申请日：2018-09-14

Applicant: ASML Holding N.V.

Inventor： Parag Vinayak KELKAR ,  Justin Lloyd KREUZER

IPC: G01B11/06 ,  G02B27/28 ,  G02B5/30

Abstract: An inspection apparatus, including: an optical system configured to provide a beam of radiation to a surface to be measured and to receive redirected radiation from the surface; and a detection system configured to measure the redirected radiation, wherein the optical system includes an optical element to process the radiation, the optical element including a Mac Neille-type multilayer polarizing coating configured to produce a reduced chromatic offset of the radiation.

公开(公告)号：US20190278179A1

公开(公告)日：2019-09-12

申请号：US16292771

申请日：2019-03-05

Applicant: ASML Holding N.V.

Inventor： Parag Vinayak KELKAR

IPC: G03F7/09 ,  H01L21/027 ,  H01L21/311 ,  G02B1/113

Abstract: A substrate provided with an anti-reflective coating where the anti-reflective coating is made up of a layer of nanostructures. The nanostructures may be formed by depositing a material such as SiO2 and then using a process such as reactive ion etching in conjunction with an inductively coupled plasma source. Other aspects of the fabrication process ae also disclosed.