公开(公告)号：US11662669B2

公开(公告)日：2023-05-30

申请号：US17625466

申请日：2020-06-15

Applicant: ASML Netherlands B.V.

Inventor： Andrey Valerievich Rogachevskiy ,  Martin Jules Marie-Emile De Nivelle ,  Arjan Gijsbertsen ,  Willem Richard Pongers ,  Viktor Trogrlic

IPC: G03F9/00 ,  G03F7/20

CPC classification number: G03F9/7092 ,  G03F7/7085 ,  G03F9/7026 ,  G03F9/7034

Abstract: An apparatus for measuring a height of a substrate for processing in a lithographic apparatus is disclosed. The apparatus comprises a first sensor for sensing a height of the substrate over a first area. The apparatus also comprises a second sensor for sensing a height of the substrate over a second area. The apparatus further comprises a processor adapted to normalize first data corresponding to a signal from the first sensor with a second sensor footprint to produce a first normalized height data, and to normalize second data corresponding to a signal from the second sensor with a first sensor footprint to produce a second normalized height data. The processor is adapted to determine a correction to a measured height of the substrate based on a difference between the first and second normalized height data.

公开(公告)号：US11029614B2

公开(公告)日：2021-06-08

申请号：US16318388

申请日：2017-06-22

Applicant: ASML NETHERLANDS B.V.

Inventor： Wim Tjibbo Tel ,  Frank Staals ,  Martin Jules Marie-Emile De Nivelle ,  Tanbir Hasan

IPC: G05B19/4097 ,  G03F9/00

Abstract: A method of determining topographical variation across a substrate on which one or more patterns have been applied. The method includes obtaining measured topography data representing a topographical variation across a substrate on which one or more patterns have been applied by a lithographic process; and combining the measured topography data with knowledge relating to intra-die topology to obtain derived topography data having a resolution greater than the resolution of the measured topography data. Also disclosed is a corresponding level sensor apparatus and lithographic apparatus having such a level sensor apparatus, and a more general method of determining variation of a physical parameter from first measurement data of variation of the physical parameter across the substrate and intra-die measurement data of higher resolution than the first measurement data and combining these.