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公开(公告)号:US11972922B2
公开(公告)日:2024-04-30
申请号:US18126322
申请日:2023-03-24
Applicant: ASML Netherlands B.V.
Inventor: Hermanus Adrianus Dillen , Wim Tjibbo Tel , Willem Louis Van Mierlo
CPC classification number: H01J37/28 , H01J37/222 , H01J2237/2826
Abstract: A method for calibrating a scanning charged particle microscope, such as a scanning electron microscope (SEM), is provided. The method includes dividing a wafer into a plurality of regions; preparing, on each of the plurality of regions, a pattern including a first periodic structure interleaved with a second periodic structure, the first and second periodic structures having an induced offset; determining an actual pitch the first and second periodic structures and thereby determining actual induced offset on each of the plurality of regions; selecting a plurality of regions from among the plurality of regions; measuring, by the SEM, a pitch of first and second periodic structures on each of the plurality of regions; and performing linearity calibration on the SEM based on the determining and the measuring.
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公开(公告)号:US11646174B2
公开(公告)日:2023-05-09
申请号:US16730848
申请日:2019-12-30
Applicant: ASML Netherlands B.V.
Inventor: Hermanus Adrianus Dillen , Wim Tjibbo Tel , Willem Louis Van Mierlo
CPC classification number: H01J37/28 , H01J37/222 , H01J2237/2826
Abstract: A method for calibrating a scanning charged particle microscope, such as a scanning electron microscope (SEM), is provided. The method includes dividing a wafer into a plurality of regions; preparing, on each of the plurality of regions, a pattern including a first periodic structure interleaved with a second periodic structure, the first and second periodic structures having an induced offset; determining an actual pitch the first and second periodic structures and thereby determining actual induced offset on each of the plurality of regions; selecting a plurality of regions from among the plurality of regions; measuring, by the SEM, a pitch of first and second periodic structures on each of the plurality of regions; and performing linearity calibration on the SEM based on the determining and the measuring.
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公开(公告)号:US11796920B2
公开(公告)日:2023-10-24
申请号:US17797506
申请日:2021-01-14
Applicant: ASML NETHERLANDS B.V.
Inventor: Jochem Sebastiaan Wildenberg , Hermanus Adrianus Dillen , Fan Feng , Ronald Van Ittersum , Willem Louis Van Mierlo , Koen Thuijs
CPC classification number: G03F7/70525
Abstract: A method and associated apparatuses for controlling a process of manufacturing semiconductor devices on a substrate. The method includes obtaining process data relating to the process and determining a correction for the process based on the process data and a first control objective associated with the devices on the substrate. A first probability of the first control objective being achievable is determined and the correction adjusted based on the probability and at least a second control objective having a second probability of being achievable compared to the first control objective.
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公开(公告)号:US20200211819A1
公开(公告)日:2020-07-02
申请号:US16730848
申请日:2019-12-30
Applicant: ASML Netherlands B.V.
Inventor: Hermanus Adrianus DILLEN , Wim Tjibbo Tel , Willem Louis Van Mierlo
Abstract: A method for calibrating a scanning charged particle microscope, such as a scanning electron microscope (SEM), is provided. The method includes dividing a wafer into a plurality of regions; preparing, on each of the plurality of regions, a pattern including a first periodic structure interleaved with a second periodic structure, the first and second periodic structures having an induced offset; determining an actual pitch the first and second periodic structures and thereby determining actual induced offset on each of the plurality of regions; selecting a plurality of regions from among the plurality of regions; measuring, by the SEM, a pitch of first and second periodic structures on each of the plurality of regions; and performing linearity calibration on the SEM based on the determining and the measuring.
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