公开(公告)号：US11796920B2

公开(公告)日：2023-10-24

申请号：US17797506

申请日：2021-01-14

Applicant: ASML NETHERLANDS B.V.

Inventor： Jochem Sebastiaan Wildenberg ,  Hermanus Adrianus Dillen ,  Fan Feng ,  Ronald Van Ittersum ,  Willem Louis Van Mierlo ,  Koen Thuijs

IPC: G03F7/20 ,  G03F7/00

CPC classification number: G03F7/70525

Abstract: A method and associated apparatuses for controlling a process of manufacturing semiconductor devices on a substrate. The method includes obtaining process data relating to the process and determining a correction for the process based on the process data and a first control objective associated with the devices on the substrate. A first probability of the first control objective being achievable is determined and the correction adjusted based on the probability and at least a second control objective having a second probability of being achievable compared to the first control objective.

公开(公告)号：US11669017B2

公开(公告)日：2023-06-06

申请号：US16762982

申请日：2018-11-09

Applicant: ASML NETHERLANDS B.V.

Inventor： Roy Werkman ,  Bijoy Rajasekharan ,  Lydia Marianna Vergaij-Huizer ,  Jochem Sebastiaan Wildenberg ,  Ronald Van Ittersum ,  Pieter Gerardus Jacobus Smorenberg ,  Robertus Wilhelmus Van Der Heijden ,  Xiuhong Wei ,  Hadi Yagubizade

IPC: G03F7/20

CPC classification number: G03F7/70458 ,  G03F7/70616

Abstract: A method for determining a plurality of corrections for control of at least one manufacturing apparatus used in a manufacturing process for providing product structures to a substrate in a plurality of layers, the method including: determining the plurality of corrections including a correction for each layer, based on an actuation potential of the applicable manufacturing apparatus used in the formation of each layer, wherein the determining includes determining corrections for each layer simultaneously in terms of a matching parameter.