公开(公告)号：US20180173104A1

公开(公告)日：2018-06-21

申请号：US15580515

申请日：2016-05-25

Applicant: ASML NETHERLANDS B.V.

Inventor： Stefan HUNSCHE ,  Rafael ALDANA LASO ,  Vivek Kumar JAIN ,  Marinus JOCHEMSEN ,  Xinjian ZHOU

IPC: G03F7/20 ,  G06T7/00 ,  G06T3/00

CPC classification number: G03F7/7065 ,  G06T3/0068 ,  G06T7/001 ,  G06T2207/30148

Abstract: A method of defect validation for a device manufacturing process, the method including: obtaining a first image of a pattern processed into an area on a substrate using the device manufacturing process under a first condition; obtaining a metrology image from the area; aligning the metrology image and the first image; and determining from the first image and the metrology image whether the area contains a defect, based on one or more classification criteria.