Inspection method, inspection system, and semiconductor fabrication using the same

    公开(公告)号:US12055861B2

    公开(公告)日:2024-08-06

    申请号:US17406529

    申请日:2021-08-19

    Inventor: Kihyun Kim

    Abstract: Provided is an inspection method including providing a pattern layout including measurement points, generating a first measurement map including first measurement regions that overlap the measurement points and do not overlap each other in a two-dimensional plan view, providing preliminary measurement regions on the measurement points, producing a polygon by grouping ones of the preliminary measurement regions that overlap each other in the two-dimensional plan view, providing a second measurement region on a center of the polygon, selecting the second measurement region when all of the measurement points in the polygon overlap the second measurement region in the two-dimensional plan view, generating a second measurement map including the selected second measurement region, generating a third measurement map by using the first and second measurement maps, and inspecting patterns on a semiconductor substrate by using the third measurement map. The third measurement map includes the selected second measurement region and ones of the first measurement regions that do not overlap the selected second measurement region in the two-dimensional plan view.

    TARGET SUPPLY DEVICE AND ELECTRONIC DEVICE MANUFACTURING METHOD

    公开(公告)号:US20240260164A1

    公开(公告)日:2024-08-01

    申请号:US18531096

    申请日:2023-12-06

    Inventor: Masaki NAKANO

    Abstract: A target supply device is configured to supply a liquid state target substance including tin to a concentration position of laser light to generate EUV light. The target supply device includes a tank configured to contain the target substance; and a nozzle communicating with an inside of the tank, and having a nozzle hole through which the target substance passes. Here, an uneven structure is formed on a surface of the nozzle provided with the nozzle hole and facing the concentration position and exhibits tin repellency larger than tin repellency exhibited by a material of the surface.

    Manufacturing method of semiconductor device

    公开(公告)号:US11996335B2

    公开(公告)日:2024-05-28

    申请号:US17471062

    申请日:2021-09-09

    Inventor: Masaya Shima

    Abstract: A manufacturing method of a semiconductor device includes inspecting each of plural chip regions of a substrate and determining the inspected chip region as a non-defective chip region or a defective chip region, the substrate including the plural chip regions formed as one system, and the plural chip regions being arranged in a planar direction on the substrate. The method includes forming a wiring, the wiring being connected to an electrode of the non-defective chip region among the plural chip regions, and the wiring being not connected to an electrode of the defective chip region among the plural chip regions.

    EXPOSURE APPARATUS AND INSPECTION METHOD
    5.
    发明公开

    公开(公告)号:US20240110844A1

    公开(公告)日:2024-04-04

    申请号:US18528108

    申请日:2023-12-04

    CPC classification number: G01M11/0264 G03F7/7065 G03F7/706849

    Abstract: An exposure apparatus exposes an object to pattern light generated by a spatial light modulator having a plurality of elements in accordance with drawing data. The exposure apparatus includes a data output unit configured to output the drawing data to the spatial light modulator, an illumination optical system configured to irradiate the spatial light modulator with illumination light, a first movable body configured to hold the object, a projection optical system configured to project an image of the pattern light generated by the spatial light modulator onto the object, a detection unit configured to detect the image of the pattern light that has been projected, and a determination unit configured to determine whether the spatial light modulator is capable of generating pattern light in accordance with the drawing data output from the data output unit, based on a detection result of the detection unit.

    Inspection device for masks for semiconductor lithography and method

    公开(公告)号:US11867642B2

    公开(公告)日:2024-01-09

    申请号:US17164198

    申请日:2021-02-01

    Abstract: The invention relates to an inspection device for masks for semiconductor lithography, comprising an imaging device for imaging a mask, and an image recording device, wherein one or more correction bodies which exhibit a dispersive behavior for at least one subrange of the illumination radiation used for the imaging are arranged in the light path between the mask and the image recording device. The invention furthermore relates to a method for taking account of longitudinal chromatic aberrations in inspection devices for masks, comprising the following steps: recording a specific number of images having differently defocused positions, and selecting a subset of the images and simulating a longitudinal chromatic aberration of a projection exposure apparatus.

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