公开(公告)号：US20230023153A1

公开(公告)日：2023-01-26

申请号：US17764245

申请日：2020-09-03

Applicant: ASML NETHERLANDS B.V

Inventor： Wim Tjibbo TEL ,  Hermanus Adrianus DILLEN ,  Koen THUIJS ,  Laurent Michel Marcel DEPRE ,  Christopher PRENTICE

IPC: G03F7/20

Abstract: A method of determining a field of view setting for an inspection tool having a configurable field of view, the method including: obtaining a process margin distribution of features on at least part of a substrate; obtaining a threshold value; identifying, in dependence on the obtained process margin distribution and the threshold value, one or more regions on at least part of the substrate; and determining the field of view setting in dependence on the identified one or more regions.

公开(公告)号：US20180011398A1

公开(公告)日：2018-01-11

申请号：US15546583

申请日：2016-01-20

Applicant: ASML Netherlands B.V.

Inventor： Wim Tjibbo TEL ,  Marinus JOCHEMSEN ,  Frank STAALS ,  Christopher PRENTICE ,  Laurent Michel Marcel DEPRE ,  Johannes Marcus Maria BELTMAN ,  Roy WERKMAN ,  Jochem Sebastiaan WILDENBERG ,  Everhardus Cornelis MOS

IPC: G03F1/70 ,  G03F1/22 ,  G06T7/00

Abstract: A method includes determining topographic information of a substrate for use in a lithographic imaging system, determining or estimating, based on the topographic information, imaging error information for a plurality of points in an image field of the lithographic imaging system, adapting a design for a patterning device based on the imaging error information. In an embodiment, a plurality of locations for metrology targets is optimized based on imaging error information for a plurality of points in an image field of a lithographic imaging system, wherein the optimizing involves minimizing a cost function that describes the imaging error information. In an embodiment, locations are weighted based on differences in imaging requirements across the image field.