Lithography system and method for processing a target, such as a wafer

    公开(公告)号:USRE49241E1

    公开(公告)日:2022-10-11

    申请号:US16568164

    申请日:2019-09-11

    Inventor: Niels Vergeer

    Abstract: A method for operating a target processing system for processing a target (23) on a chuck (13), the method comprising providing at least a first chuck position mark (27) and a second chuck position mark (28) on the chuck (13); providing an alignment sensing system (17) arranged for detecting the first and second chuck position marks (27, 28), the alignment sensing system (17) comprising at least a first alignment sensor (61) and a second alignment sensor (62); moving the chuck (13) to a first position based on at least one measurement of the alignment sensing system (17); and measuring at least one value related to the first position of the chuck.

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