公开(公告)号：US20220277926A1

公开(公告)日：2022-09-01

申请号：US17753298

申请日：2020-08-25

Applicant: ASML Netherlands B.V.

Inventor： Yixiang WANG ,  Shibing LIU ,  Shanhui CAO ,  Kangsheng QIU ,  Juying DOU ,  Ying LUO ,  Yinglong LI ,  Qiang LI ,  Ronald VAN DER WILK ,  Jan-Gerard Cornelis VAN DER TOORN

IPC: H01J37/20 ,  H01L21/683

Abstract: Systems and methods for wafer grounding and wafer grounding location adjustment are disclosed. A first method may include receiving a first value of an electric characteristic associated with the wafer being grounded by an electric signal; determining a first control parameter using at least the first value; and controlling a characteristic of the electric signal using the first control parameter and the first value. A second method for adjusting a grounding location for a wafer may include terminating an electric connection between the wafer and at least one grounding pin in contact the wafer; adjusting a relative position between the wafer and the grounding pin; and restoring the electric connection between the grounding pin and the wafer. A third method may include causing a grounding pin to penetrate through a coating on the wafer by impact; and establishing an electrical connection between the grounding pin and the wafer.