METHOD, APPARATUS, AND SYSTEM FOR WAFER GROUNDING

    公开(公告)号:US20220277926A1

    公开(公告)日:2022-09-01

    申请号:US17753298

    申请日:2020-08-25

    IPC分类号: H01J37/20 H01L21/683

    摘要: Systems and methods for wafer grounding and wafer grounding location adjustment are disclosed. A first method may include receiving a first value of an electric characteristic associated with the wafer being grounded by an electric signal; determining a first control parameter using at least the first value; and controlling a characteristic of the electric signal using the first control parameter and the first value. A second method for adjusting a grounding location for a wafer may include terminating an electric connection between the wafer and at least one grounding pin in contact the wafer; adjusting a relative position between the wafer and the grounding pin; and restoring the electric connection between the grounding pin and the wafer. A third method may include causing a grounding pin to penetrate through a coating on the wafer by impact; and establishing an electrical connection between the grounding pin and the wafer.

    STAGE APPARATUS SUITABLE FOR A PARTICLE BEAM APPARATUS

    公开(公告)号:US20220028648A1

    公开(公告)日:2022-01-27

    申请号:US17497761

    申请日:2021-10-08

    IPC分类号: H01J37/20 H01J37/26 H01J37/28

    摘要: A stage apparatus for a particle-beam apparatus is disclosed. A particle beam apparatus may comprise a conductive object and an object table, the object table being configured to support an object. The object table comprises a table body and a conductive coating, the conductive coating being provided on at least a portion of a surface of the table body. The conductive object is disposed proximate to the conductive coating and the table body is provided with a feature proximate to an edge portion of the conductive coating. Said feature is arranged so as to reduce an electric field strength in the vicinity of the edge portion of the conductive coating when a voltage is applied to both the conductive object and the conductive coating.