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Patent Agency Ranking
公开(公告)号：US20160006093A1
公开(公告)日：2016-01-07
申请号：US14622925
申请日：2015-02-16
Applicant: ASUSTeK COMPUTER INC.
Inventor： Bin-Chyi Tseng , Tsung-Chieh Yen , Chih-Chung Lin
CPC classification number: H01Q19/021 , H01P1/2005 , H01Q1/243 , H01Q15/006 , H05K1/00 , H05K1/0236 , H05K1/165
Abstract: An electromagnetic bandgap structure and an electronic device having the same are provided. The electromagnetic bandgap structure includes a first conductive element, a second conductive element and a planar inductive element. The planar inductive element is disposed between the first conductive element and the second conductive element. Furthermore, the planar inductive element is electrically connected to the first conductive element via a first conductive pillar, and it is electrically connected to the second conductive element via a second conductive pillar.
Abstract translation: 提供电磁带隙结构和具有该电磁带隙结构的电子装置。 电磁带隙结构包括第一导电元件，第二导电元件和平面电感元件。 平面感应元件设置在第一导电元件和第二导电元件之间。 此外，平面感应元件经由第一导电柱电连接到第一导电元件，并且其经由第二导电柱电连接到第二导电元件。
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公开(公告)号：US09627746B2
公开(公告)日：2017-04-18
申请号：US14029825
申请日：2013-09-18
Applicant: ASUSTeK COMPUTER INC.
Inventor： Saou-Wen Su , Fang-Hsien Chu , Chih-Chung Lin
CPC classification number: H01Q1/36 , H01Q1/243 , H01Q9/0414 , H01Q9/0421 , H01Q9/0471
Abstract: A wireless communication apparatus and an antenna system therein are provided. The antenna system includes a grounding portion and an antenna body. The grounding portion includes a ground plane and a conducting element. The conducting element is perpendicular to the ground plane and is connected to the ground plane to provide a first current path. The antenna body includes a main radiating portion and a short circuit portion. The main radiating portion is parallel to the ground plane and provides a second current path. An end of the main radiating portion is electrically connected to a signal source. The short circuit portion is electrically connected between the main radiating portion and the conducting element and provides a third current path. The directions of the first current path, the second current path and the third current path are perpendicular mutually.
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公开(公告)号：US09833159B2
公开(公告)日：2017-12-05
申请号：US14689044
申请日：2015-04-16
Applicant: ASUSTeK COMPUTER INC.
Inventor： Fang-Hsien Chu , Chih-Chung Lin , Yi-Ting Hsieh , Chia-Min Chuang , Saou-Wen Su , Bin-Chyi Tseng , Jian-Sheng Hsieh , Tsung-Chieh Yen
IPC: A61B5/0408 , G06F1/16 , A61B5/00
CPC classification number: A61B5/0408 , A61B5/0002 , A61B5/04085 , A61B5/681 , G06F1/163 , G06F1/1698
Abstract: A wearable electronic device includes a device body and a wearing element. The wearing element is connected to the device body. The device body includes a conductive upper cover, a conductive lower cover, an insulating frame and a circuit system. The insulating frame is disposed between the conductive upper cover and the conductive lower cover and forms an accommodating space therewith. The circuit system is disposed in the accommodating space. The conductive upper cover has a first feeding point. The conductive lower cover has a second feeding point. The circuit system is coupled to the first feeding point and the second feeding point respectively.
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公开(公告)号：US09755320B2
公开(公告)日：2017-09-05
申请号：US14622925
申请日：2015-02-16
Applicant: ASUSTeK COMPUTER INC.
Inventor： Bin-Chyi Tseng , Tsung-Chieh Yen , Chih-Chung Lin
CPC classification number: H01Q19/021 , H01P1/2005 , H01Q1/243 , H01Q15/006 , H05K1/00 , H05K1/0236 , H05K1/165
Abstract: An electromagnetic bandgap structure and an electronic device having the same are provided. The electromagnetic bandgap structure includes a first conductive element, a second conductive element and a planar inductive element. The planar inductive element is disposed between the first conductive element and the second conductive element. Furthermore, the planar inductive element is electrically connected to the first conductive element via a first conductive pillar, and it is electrically connected to the second conductive element via a second conductive pillar.
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公开(公告)号：US20160062417A1
公开(公告)日：2016-03-03
申请号：US14689044
申请日：2015-04-16
Applicant: ASUSTeK COMPUTER INC.
Inventor： Fang-Hsien Chu , Chih-Chung Lin , Yi-Ting Hsieh , Chia-Min Chuang , Saou-Wen Su , Bin-Chyi Tseng , Jian-Sheng Hsieh , Tsung-Chieh Yen
IPC: G06F1/16 , A61B5/0408 , A61B5/00
CPC classification number: A61B5/0408 , A61B5/0002 , A61B5/04085 , A61B5/681 , G06F1/163 , G06F1/1698
Abstract: A wearable electronic device includes a device body and a wearing element. The wearing element is connected to the device body. The device body includes a conductive upper cover, a conductive lower cover, an insulating frame and a circuit system. The insulating frame is disposed between the conductive upper cover and the conductive lower cover and forms an accommodating space therewith. The circuit system is disposed in the accommodating space. The conductive upper cover has a first feeding point. The conductive lower cover has a second feeding point. The circuit system is coupled to the first feeding point and the second feeding point respectively.
Abstract translation: 佩戴式电子装置包括装置本体和磨损元件。 磨损元件连接到设备主体。 装置主体包括导电上盖，导电下盖，绝缘框架和电路系统。 绝缘框架设置在导电上盖和导电下盖之间并与之形成容纳空间。 电路系统设置在容纳空间中。 导电上盖具有第一馈电点。 导电下盖具有第二馈电点。 电路系统分别耦合到第一馈电点和第二馈电点。
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