公开(公告)号：US20250098181A1

公开(公告)日：2025-03-20

申请号：US18829848

申请日：2024-09-10

Applicant: Advanced Micro Devices, Inc.

Inventor： Alan D. SMITH ,  Samuel NAFFZIGER ,  Joe MACRI ,  James R. MAGRO ,  Vydhyanathan KALYANASUNDHARAM

IPC: H10B80/00 ,  H01L23/498 ,  H01L25/065 ,  H01L25/18

Abstract: A package device includes a processing device, memory dies and a memory controller. The memory controller die is coupled to the processing device and the memory dies. The memory controller die controls communication from the processing device to the memory dies and to an external memory device. The external memory device is external to the memory dies.