公开(公告)号：US20250004955A1

公开(公告)日：2025-01-02

申请号：US18215519

申请日：2023-06-28

Applicant: Advanced Micro Devices, Inc.

Inventor： Anthony Thomas Gutierrez ,  Todd David Basso ,  Gabriel Hsiuwei Loh

IPC: G06F13/16 ,  G06F13/366

Abstract: Programmable I/O die devices and methods are described. An example system includes an input/output die (IOD) that couples a plurality of devices. The system also includes a programmable fabric included in the IOD. The programmable fabric implements interconnects for connecting the plurality of devices according to a reconfigurable topology defined by a configuration of the programmable fabric.

公开(公告)号：US20240220438A1

公开(公告)日：2024-07-04

申请号：US18090254

申请日：2022-12-28

Applicant: Advanced Micro Devices, Inc.

Inventor： Gabriel Hsiuwei Loh ,  Todd David Basso

IPC: G06F13/40 ,  G06F1/08 ,  H01L23/538 ,  H01L25/065

CPC classification number: G06F13/4068 ,  G06F1/08 ,  H01L23/538 ,  H01L25/0655

Abstract: The disclosed semiconductor package includes a first chiplet area for receiving a first chiplet, a second chiplet area for receiving a second chiplet, and a host die coupled to the first and second chiplet areas. The semiconductor package also includes an interconnect directly coupling the first chiplet area to the second chiplet area. Various other methods, systems, and computer-readable media are also disclosed.