公开(公告)号：US20240332098A1

公开(公告)日：2024-10-03

申请号：US18128940

申请日：2023-03-30

Applicant: Advanced Micro Devices, Inc. ,  ATI Technologies ULC

Inventor： Suming HU ,  Roden TOPACIO ,  Manish DUBEY ,  Jianguo LI

IPC: H01L23/051 ,  H01L21/56 ,  H01L23/31

CPC classification number: H01L23/051 ,  H01L21/563 ,  H01L23/3114

Abstract: A chip package includes a package substrate, an integrated circuit (IC) die disposed on the package substrate, and a lid assembly disposed over the IC die. The lid assembly includes a top plate having a lower surface facing the IC die and an outer shoulder. The lid assembly also includes a retainer having a lower surface secured to the package substrate and an inner shoulder retaining to the outer shoulder. The inner shoulder is configured to limit upward movement of the top plate, and expansion of the retainer is decoupled from expansion of the top plate.