公开(公告)号：US20200251449A1

公开(公告)日：2020-08-06

申请号：US16779249

申请日：2020-01-31

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Shang-Ruei Wu ,  Chien-Yuan Tseng ,  Meng-Jen Wang ,  Chen-Tsung Chang ,  Chih-Fang Wang ,  Cheng-Han Li ,  Chien-Hao Chen ,  An-Chi Tsao ,  Per-Ju Chao

IPC: H01L25/065 ,  H01L23/31 ,  H01L21/768 ,  H01L21/02

Abstract: A semiconductor device package includes a substrate, a connection structure, a first package body and a first electronic component. The substrate has a first surface and a second surface opposite to the first surface. The connection structure is disposed on the firs surface of the substrate. The first package body is disposed on the first surface of the substrate. The first package body covers the connection structure and exposes a portion of the connection structure. The first electronic component is disposed on the first package body and in contact with the portion of the connection structure exposed from the first package body.

公开(公告)号：US11887967B2

公开(公告)日：2024-01-30

申请号：US17493709

申请日：2021-10-04

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Shang-Ruei Wu ,  Chien-Yuan Tseng ,  Meng-Jen Wang ,  Chen-Tsung Chang ,  Chih-Fang Wang ,  Cheng-Han Li ,  Chien-Hao Chen ,  An-Chi Tsao ,  Per-Ju Chao

IPC: H01L25/065 ,  H01L21/02 ,  H01L21/768 ,  H01L23/31

CPC classification number: H01L25/0657 ,  H01L21/02631 ,  H01L21/76838 ,  H01L23/3121

Abstract: A semiconductor device package includes a substrate, a connection structure, a first package body and a first electronic component. The substrate has a first surface and a second surface opposite to the first surface. The connection structure is disposed on the firs surface of the substrate. The first package body is disposed on the first surface of the substrate. The first package body covers the connection structure and exposes a portion of the connection structure. The first electronic component is disposed on the first package body and in contact with the portion of the connection structure exposed by the first package body.

公开(公告)号：US11139274B2

公开(公告)日：2021-10-05

申请号：US16779249

申请日：2020-01-31

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Shang-Ruei Wu ,  Chien-Yuan Tseng ,  Meng-Jen Wang ,  Chen-Tsung Chang ,  Chih-Fang Wang ,  Cheng-Han Li ,  Chien-Hao Chen ,  An-Chi Tsao ,  Per-Ju Chao

IPC: H01L25/065 ,  H01L21/02 ,  H01L21/768 ,  H01L23/31

Abstract: A semiconductor device package includes a substrate, a connection structure, a first package body and a first electronic component. The substrate has a first surface and a second surface opposite to the first surface. The connection structure is disposed on the first surface of the substrate. The first package body is disposed on the first surface of the substrate. The first package body covers the connection structure and exposes a portion of the connection structure. The first electronic component is disposed on the first package body and in contact with the portion of the connection structure exposed from the first package body.