公开(公告)号：US10522505B2

公开(公告)日：2019-12-31

申请号：US15918906

申请日：2018-03-12

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chih-Ming Hung ,  Meng-Jen Wang ,  Tsung-Yueh Tsai ,  Jen-Kai Ou

IPC: H01L23/00 ,  H01L27/146 ,  H01L21/56 ,  H01L23/31 ,  H01L23/544 ,  G06K9/00

Abstract: A surface mount structure includes a substrate, a sensor, an electrical contact and a package body. The substrate has a first surface and a second surface opposite to the first surface. The sensor is disposed adjacent to the second surface of the substrate. The electrical contact is disposed on the first surface of the substrate. The package body covers the first surface and the second surface of the substrate, a portion of the sensor and a first portion of the electrical contact.

公开(公告)号：US11626525B2

公开(公告)日：2023-04-11

申请号：US17013350

申请日：2020-09-04

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chun Yu Ko ,  Tsu-Hsiu Wu ,  Meng-Jen Wang

IPC: H01L31/0203 ,  H01L31/0232 ,  H01L31/02 ,  H01L23/00

Abstract: A package structure is provided. The package structure includes a substrate, a sensor device, an encapsulant and a signal blocking structure. The substrate has a signal passing area. The sensor device is disposed over the substrate. The sensor device has a first surface, a second surface opposite to the first surface and a sensing area located at the second surface. The second surface of the sensor device faces the substrate. The encapsulant covers the sensor device and the substrate. The signal blocking structure extends from the substrate into the encapsulant.

公开(公告)号：US11302682B2

公开(公告)日：2022-04-12

申请号：US16664652

申请日：2019-10-25

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Tsung-Yueh Tsai ,  Meng-Jen Wang ,  Yu-Fang Tsai ,  Meng-Jung Chuang

IPC: H01L25/16 ,  H01L23/31 ,  H01L21/52 ,  H01L23/538 ,  H01L21/48

Abstract: An optical device package comprises a carrier having a first surface and a second surface recessed with respect to the first surface and a lid disposed on the second surface of the carrier.

公开(公告)号：US10937761B2

公开(公告)日：2021-03-02

申请号：US16709623

申请日：2019-12-10

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chih-Ming Hung ,  Meng-Jen Wang ,  Tsung-Yueh Tsai ,  Jen-Kai Ou

IPC: H01L23/00 ,  H01L27/146 ,  H01L23/544 ,  H01L23/31 ,  H01L21/56 ,  G06K9/00

Abstract: A semiconductor device includes: a substrate having a first surface and a second surface opposite to the first surface; an electronic component disposed on the first surface of the substrate; a sensor disposed adjacent to the second surface of the substrate; an electrical contact disposed on the first surface of the substrate; and a package body exposing a portion of the electrical contact.

公开(公告)号：US10242940B2

公开(公告)日：2019-03-26

申请号：US15655724

申请日：2017-07-20

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Jung-Liang Yeh ,  Meng-Jen Wang ,  Tsung-Yueh Tsai ,  Chih-Ming Hung

IPC: H01L23/498 ,  H01L23/31 ,  H01L23/00 ,  H01L25/18 ,  G06K9/00 ,  H01L21/56

Abstract: A surface mount structure comprises a redistribution structure, an electrical connection and an encapsulant. The redistribution structure has a first surface and a second surface opposite the first surface. The electrical connection is on the first surface of the redistribution structure. The encapsulant encapsulates the first surface of the redistribution structure and the electrical connection. A portion of the electrical connection is exposed by the encapsulant.

公开(公告)号：US12009353B2

公开(公告)日：2024-06-11

申请号：US17719280

申请日：2022-04-12

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Tsung-Yueh Tsai ,  Meng-Jen Wang ,  Yu-Fang Tsai ,  Meng-Jung Chuang

IPC: H01L25/16 ,  H01L21/48 ,  H01L21/52 ,  H01L23/31 ,  H01L23/538

CPC classification number: H01L25/167 ,  H01L21/4817 ,  H01L21/52 ,  H01L23/3128 ,  H01L23/5386 ,  H01L23/5389 ,  H01L25/165

Abstract: An optical device package comprises a carrier having a first surface and a second surface recessed with respect to the first surface and a lid disposed on the second surface of the carrier.

公开(公告)号：US11887967B2

公开(公告)日：2024-01-30

申请号：US17493709

申请日：2021-10-04

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Shang-Ruei Wu ,  Chien-Yuan Tseng ,  Meng-Jen Wang ,  Chen-Tsung Chang ,  Chih-Fang Wang ,  Cheng-Han Li ,  Chien-Hao Chen ,  An-Chi Tsao ,  Per-Ju Chao

IPC: H01L25/065 ,  H01L21/02 ,  H01L21/768 ,  H01L23/31

CPC classification number: H01L25/0657 ,  H01L21/02631 ,  H01L21/76838 ,  H01L23/3121

Abstract: A semiconductor device package includes a substrate, a connection structure, a first package body and a first electronic component. The substrate has a first surface and a second surface opposite to the first surface. The connection structure is disposed on the firs surface of the substrate. The first package body is disposed on the first surface of the substrate. The first package body covers the connection structure and exposes a portion of the connection structure. The first electronic component is disposed on the first package body and in contact with the portion of the connection structure exposed by the first package body.

公开(公告)号：US11682653B2

公开(公告)日：2023-06-20

申请号：US17180364

申请日：2021-02-19

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chih-Ming Hung ,  Meng-Jen Wang ,  Tsung-Yueh Tsai ,  Jen-Kai Ou

IPC: H01L23/00 ,  H01L23/544 ,  H01L21/56 ,  H01L27/146 ,  H01L23/31 ,  G06K9/00 ,  G06V40/13

CPC classification number: H01L24/96 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L23/31 ,  H01L23/315 ,  H01L23/3107 ,  H01L23/3121 ,  H01L23/544 ,  H01L24/13 ,  H01L27/1469 ,  H01L27/14618 ,  H01L27/14634 ,  H01L27/14636 ,  G06V40/1318 ,  G06V40/1329 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L2223/54426 ,  H01L2223/54486 ,  H01L2224/13014 ,  H01L2224/1319 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/13583 ,  H01L2224/13611 ,  H01L2224/13639 ,  H01L2224/13644 ,  H01L2224/13647 ,  H01L2224/13655 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/95001 ,  H01L2924/014 ,  H01L2924/15321 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/73204 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2924/00012

Abstract: A semiconductor device includes: a substrate having a first surface and a second surface opposite to the first surface; an electronic component disposed on the first surface of the substrate; a sensor disposed adjacent to the second surface of the substrate; an electrical contact disposed on the first surface of the substrate; and a package body exposing a portion of the electrical contact.

公开(公告)号：US11139274B2

公开(公告)日：2021-10-05

申请号：US16779249

申请日：2020-01-31

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Shang-Ruei Wu ,  Chien-Yuan Tseng ,  Meng-Jen Wang ,  Chen-Tsung Chang ,  Chih-Fang Wang ,  Cheng-Han Li ,  Chien-Hao Chen ,  An-Chi Tsao ,  Per-Ju Chao

IPC: H01L25/065 ,  H01L21/02 ,  H01L21/768 ,  H01L23/31

Abstract: A semiconductor device package includes a substrate, a connection structure, a first package body and a first electronic component. The substrate has a first surface and a second surface opposite to the first surface. The connection structure is disposed on the first surface of the substrate. The first package body is disposed on the first surface of the substrate. The first package body covers the connection structure and exposes a portion of the connection structure. The first electronic component is disposed on the first package body and in contact with the portion of the connection structure exposed from the first package body.

公开(公告)号：US10545581B2

公开(公告)日：2020-01-28

申请号：US15726034

申请日：2017-10-05

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Jen-Kai Ou ,  Meng-Jen Wang ,  Tsung-Yueh Tsai ,  Chih-Ming Hung

IPC: G06F3/02 ,  G06F3/041 ,  H01L41/053 ,  H01L41/23 ,  H01L41/319 ,  H01L41/293 ,  G06F3/01

Abstract: An electronic device includes a piezoelectric module, a sensing module and a buffer element. The piezoelectric module includes a substrate and a piezoelectric element. The substrate defines an opening penetrating the substrate. The piezoelectric element is disposed on the substrate and across the opening of the substrate. The sensing module is disposed over the piezoelectric module. The buffer element is disposed between the piezoelectric module and the sensing module.