公开(公告)号：US12156336B2

公开(公告)日：2024-11-26

申请号：US17856898

申请日：2022-07-01

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chiung-Ying Kuo ,  Hung-Chun Kuo ,  Pao-Nan Lee ,  Jung Jui Kang ,  Chang Chi Lee

IPC: H05K1/18 ,  H05K1/02

Abstract: An electronic device is disclosed. The electronic device includes a carrier including a first portion, a second portion over the first portion, and a third portion connecting the first portion and the second portion. The electronic device also includes a first electronic component disposed between the first portion and the second portion. An active surface of the first electronic component faces the second portion. The electronic device also includes a second electronic component disposed over the second portion. The first portion is configured to transmit a first power signal to a backside surface of the first electronic component opposite to the active surface.

公开(公告)号：US12211780B2

公开(公告)日：2025-01-28

申请号：US17569447

申请日：2022-01-05

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chiung-Ying Kuo ,  Hung-Chun Kuo

IPC: H01L23/498 ,  G02B6/12 ,  H01L23/31

Abstract: An electronic package structure is provided. The electronic package structure includes a first carrier, a first electronic component, a first optical channel, and a second electronic component. The first electronic component is disposed on or within the first carrier. The first optical channel is disposed within the first carrier. The first optical channel is configured to provide optical communication between the first electronic component and the second electronic component. The first carrier is configured to electrically connect the first electronic component.

公开(公告)号：US11973018B2

公开(公告)日：2024-04-30

申请号：US17668237

申请日：2022-02-09

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chiung-Ying Kuo ,  Hung-Chun Kuo

IPC: H01L23/50 ,  H01L23/31 ,  H01L23/498

CPC classification number: H01L23/50 ,  H01L23/3107 ,  H01L23/49816

Abstract: An electronic package is provided. The electronic package includes a power regulating component, an electronic component, and a circuit structure. The circuit structure separates the power regulating component and the electronic component. The circuit structure is configured to provide a first power to the power regulating component. The power regulating component is configured to provide a second power to the electronic component through the circuit structure.