公开(公告)号：US12156336B2

公开(公告)日：2024-11-26

申请号：US17856898

申请日：2022-07-01

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chiung-Ying Kuo ,  Hung-Chun Kuo ,  Pao-Nan Lee ,  Jung Jui Kang ,  Chang Chi Lee

IPC: H05K1/18 ,  H05K1/02

Abstract: An electronic device is disclosed. The electronic device includes a carrier including a first portion, a second portion over the first portion, and a third portion connecting the first portion and the second portion. The electronic device also includes a first electronic component disposed between the first portion and the second portion. An active surface of the first electronic component faces the second portion. The electronic device also includes a second electronic component disposed over the second portion. The first portion is configured to transmit a first power signal to a backside surface of the first electronic component opposite to the active surface.

公开(公告)号：US12213247B2

公开(公告)日：2025-01-28

申请号：US17865380

申请日：2022-07-14

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Jung Jui Kang ,  Chang Chi Lee

IPC: H05K1/02 ,  H05K1/14

Abstract: An electronic device is disclosed. The electronic device includes a carrier, a computing element disposed over the carrier, and a first data storage element disposed over the carrier and electrically connected with the computing element through the carrier. The computing element is configured to receive a first power provided from the first data storage element.

公开(公告)号：US12107074B2

公开(公告)日：2024-10-01

申请号：US18115743

申请日：2023-02-28

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chang Chi Lee ,  Jung Jui Kang ,  Chiu-Wen Lee ,  Li Chieh Chen

IPC: H01L25/065 ,  H01L23/538

CPC classification number: H01L25/0655 ,  H01L23/5385 ,  H01L23/5386 ,  H01L23/5387

Abstract: A semiconductor package and a method for manufacturing a semiconductor package are provided. The semiconductor package includes a first processing element, a first I/O element, a second processing element, and a second I/O element. The first processing element is on a substrate. The first I/O element is on the substrate and electrically connected to the first processing element. The second processing element is on the substrate. The second I/O element is on the substrate and electrically connected to the second processing element. The first I/O element is electrically connected to and physically separated from the second I/O element.

公开(公告)号：US11598927B1

公开(公告)日：2023-03-07

申请号：US17472328

申请日：2021-09-10

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Jr-Wei Lin ,  Mei-Ju Lu ,  Jung Jui Kang

IPC: G02B6/43 ,  G02B6/42

Abstract: An optoelectronic device includes a carrier, an electronic component, a photonic component and a supportive component. The electronic component is electrically coupled to the carrier. The photonic component is electrically coupled to the electronic component. The supportive component is disposed outside the photonic component and the electronic component and configured to support an optical component.

公开(公告)号：US11991827B2

公开(公告)日：2024-05-21

申请号：US17966701

申请日：2022-10-14

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chun-Yen Ting ,  Pao-Nan Lee ,  Hung-Chun Kuo ,  Jung Jui Kang ,  Chang Chi Lee

IPC: H05K1/14

CPC classification number: H05K1/141

Abstract: An electronic device is disclosed. The electronic device includes a system board and a first set of electronic devices disposed over the system board. Each of the first set of electronic devices comprises a processing unit and a carrier carrying the processing unit. The electronic device also includes a first interconnection structure electrically connected with the processing unit through the carrier and configured to receive a first power from a first power supply unit and to transmit the first power to the processing unit.

公开(公告)号：US11967559B2

公开(公告)日：2024-04-23

申请号：US17535400

申请日：2021-11-24

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chang Chi Lee ,  Chiu-Wen Lee ,  Jung Jui Kang

IPC: H01L23/538 ,  H01L25/065

CPC classification number: H01L23/5384 ,  H01L23/5386 ,  H01L25/0655

Abstract: An electronic package is provided. The electronic package includes a semiconductor substrate. The semiconductor substrate includes a first active region and a first passive region separated from the first active region. The first active region is configured to regulate a power signal. The first passive region is configured to transmit a data signal.

公开(公告)号：US11594518B2

公开(公告)日：2023-02-28

申请号：US17338600

申请日：2021-06-03

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chang Chi Lee ,  Jung Jui Kang ,  Chiu-Wen Lee ,  Li Chieh Chen

IPC: H01L25/065 ,  H01L23/538

Abstract: A semiconductor package and a method for manufacturing a semiconductor package are provided. The semiconductor package includes a first processing element, a first I/O element, a second processing element, and a second I/O element. The first processing element is on a substrate. The first I/O element is on the substrate and electrically connected to the first processing element. The second processing element is on the substrate. The second I/O element is on the substrate and electrically connected to the second processing element. The first I/O element is electrically connected to and physically separated from the second I/O element.