公开(公告)号：US11174157B2

公开(公告)日：2021-11-16

申请号：US16452370

申请日：2019-06-25

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chi Sheng Tseng ,  Lu-Ming Lai ,  Yu-Hsuan Tsai ,  Yin-Hao Chen ,  Hsin Lin Wu ,  San-Kuei Yu

IPC: B81C1/00 ,  H01L23/498 ,  H01L23/00 ,  B81B7/00

Abstract: A semiconductor device package includes a semiconductor device, a non-semiconductor substrate over the semiconductor device, and a first connection element extending from the semiconductor device to the non-semiconductor substrate and electrically connecting the semiconductor device to the non-semiconductor substrate.

公开(公告)号：US11081413B2

公开(公告)日：2021-08-03

申请号：US16282147

申请日：2019-02-21

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hsin Lin Wu ,  Yu-Hsuan Tsai ,  Chang Chin Tsai ,  Lu-Ming Lai ,  Ching-Han Huang

IPC: H01L23/20 ,  H01L23/043 ,  H01L21/48 ,  H01L23/10 ,  H01L23/26 ,  H01L23/053

Abstract: A semiconductor package structure includes a substrate, a semiconductor die, a lid and a cap. The semiconductor die is disposed on the substrate. The lid is disposed on the substrate. The cap is disposed on the lid. The substrate, the lid and the cap define a cavity in which the semiconductor die is disposed, and a pressure in the cavity is greater than an atmospheric pressure outside the cavity.