公开(公告)号：US12237272B2

公开(公告)日：2025-02-25

申请号：US17548333

申请日：2021-12-10

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hui-Ping Jian ,  Ming-Hung Chen ,  Jia-Feng Ho

IPC: H01L23/552 ,  H01L21/56 ,  H01L23/13 ,  H01L23/498 ,  H01Q1/22 ,  H01L23/31

Abstract: An electronic device is disclosed. The electronic device includes a carrier having a first surface and a first lateral surface, an antenna adjacent to the first surface of the carrier, and a shielding layer covering a portion of the first lateral surface of the carrier. The shielding layer is configured to allow a gain of the antenna to be greater than 20 dB.

公开(公告)号：US11302647B2

公开(公告)日：2022-04-12

申请号：US16874524

申请日：2020-05-14

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Ming-Hung Chen ,  Hui-Ping Jian ,  Wei-Zhen Qiu

IPC: H01L23/552

Abstract: The present disclosure provides for a semiconductor device package and a method for manufacturing the same. The semiconductor device package includes a substrate, a conductive element and conductive layers. The substrate has a first surface, a second surface opposite to the first surface and a lateral surface extending between the first surface and the second surface. The conductive element is disposed on the first surface of the substrate. The conductive layers have a first portion on the conductive element and a second portion on the lateral surface of the substrate. A number of layers of the first portion of the conductive layers is different from a number of layers of the second portion of the conductive layers.