公开(公告)号：US11201200B2

公开(公告)日：2021-12-14

申请号：US16550110

申请日：2019-08-23

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Ming-Hung Chen ,  Sheng-Yu Chen ,  Chang-Lin Yeh ,  Yung-I Yeh

IPC: H01L27/32 ,  H01L25/16 ,  H01L29/786 ,  H01L51/52 ,  H01L27/11 ,  H01L27/15

Abstract: A semiconductor device package includes a display device, an electronic module and a conductive adhesion layer. The display device includes a first substrate and a TFT layer. The first substrate has a first surface and a second surface opposite to the first surface. The TFT layer is disposed on the first surface of the first substrate. The electronic module includes a second substrate and an electronic component. The second substrate has a first surface facing the second surface of the first substrate and a second surface opposite to the first surface. The electronic component is disposed on the second surface of the second substrate. The conductive adhesion layer is disposed between the first substrate and the second substrate.

公开(公告)号：US11289394B2

公开(公告)日：2022-03-29

申请号：US16725307

申请日：2019-12-23

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Sheng-Yu Chen ,  Chang-Lin Yeh ,  Ming-Hung Chen

IPC: H01L23/31 ,  H01L23/00 ,  H01L23/29 ,  H01L23/538 ,  H01L25/065 ,  H01L21/56

Abstract: A semiconductor package includes a substrate having a first side and a second side opposite to the first side, a first type semiconductor die disposed on the first side of the substrate, a first compound attached to the first side and encapsulating the first type semiconductor die, and a second compound attached to the second side, causing a stress with respect to the first type semiconductor die in the first compound. A method for manufacturing the semiconductor package described herein is also disclosed.

公开(公告)号：US12185475B2

公开(公告)日：2024-12-31

申请号：US17239475

申请日：2021-04-23

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Tun-Ching Pi ,  Ming-Hung Chen

IPC: H05K1/02 ,  A61B5/00 ,  G06F1/16 ,  H05K3/34

Abstract: The present disclosure provides an electronic device and method of manufacturing the same. The electronic device includes a first region, a second region, an electronic component, and a first sensing element. The second region is adjacent to the first region. The first region has a first pliability. The second region has a second pliability. The second pliability is greater than the first pliability. The electronic component is disposed at the first region. The first sensing element is disposed at the second region and electrically connected to the electronic component.

公开(公告)号：US12089349B2

公开(公告)日：2024-09-10

申请号：US18239723

申请日：2023-08-29

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Ming-Hung Chen ,  Yung I Yeh ,  Chang-Lin Yeh ,  Sheng-Yu Chen

IPC: H01L23/00 ,  H05K1/14 ,  H05K1/18 ,  H05K3/28 ,  H05K5/00 ,  H05K5/06 ,  H05K9/00

CPC classification number: H05K5/0017 ,  H05K1/142 ,  H05K1/144 ,  H05K1/181 ,  H05K3/284 ,  H05K5/065 ,  H05K9/0022 ,  H05K2201/041 ,  H05K2201/10037 ,  H05K2201/10128 ,  H05K2201/10151 ,  H05K2203/1316 ,  H05K2203/1327

Abstract: A semiconductor device package includes a display device, an encapsulation layer disposed in direct contact with the display device, and a reinforced structure surrounded by the encapsulation layer. The reinforced structure is spaced apart from a surface of the display device. A method of manufacturing a semiconductor device package is also disclosed.

公开(公告)号：US11997888B2

公开(公告)日：2024-05-28

申请号：US17549784

申请日：2021-12-13

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Ming-Hung Chen ,  Sheng-Yu Chen ,  Chang-Lin Yeh ,  Yung-I Yeh

IPC: H10K59/129 ,  H01L25/16 ,  H01L27/15 ,  H01L29/786 ,  H10B10/00 ,  H10K50/30 ,  H10K59/125

CPC classification number: H10K59/129 ,  H01L25/16 ,  H01L25/167 ,  H01L27/156 ,  H01L29/786 ,  H10B10/125 ,  H10K50/30 ,  H10K59/125

Abstract: A semiconductor device package includes a display device, an electronic module and a conductive adhesion layer. The display device includes a first substrate and a TFT layer. The first substrate has a first surface and a second surface opposite to the first surface. The TFT layer is disposed on the first surface of the first substrate. The electronic module includes a second substrate and an electronic component. The second substrate has a first surface facing the second surface of the first substrate and a second surface opposite to the first surface. The electronic component is disposed on the second surface of the second substrate. The conductive adhesion layer is disposed between the first substrate and the second substrate.

公开(公告)号：US11682631B2

公开(公告)日：2023-06-20

申请号：US17346068

申请日：2021-06-11

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Ming-Hung Chen ,  Zheng Wei Wu

IPC: H01L23/552 ,  H01L21/768 ,  H01L21/78 ,  H01L21/50 ,  H01L23/00

CPC classification number: H01L23/552 ,  H01L21/50 ,  H01L21/768 ,  H01L21/78 ,  H01L24/14 ,  H01L2924/3025

Abstract: The present disclosure provides a semiconductor device package including a substrate having a first surface and a second surface opposite to the first surface, a first package body disposed on the first surface, and a conductive layer covering the first package body and the substrate. The conductive layer includes a first portion on the top surface of the first package body and a second portion on the lateral surface of the first package body and a sidewall of the substrate. The second portion of the conductive layer has a tapered shape. A method for manufacturing a semiconductor device package is also provided.

公开(公告)号：US10658257B1

公开(公告)日：2020-05-19

申请号：US16178241

申请日：2018-11-01

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Dao-Long Chen ,  Chih-Pin Hung ,  Ming-Hung Chen

IPC: H01L23/29 ,  H01L23/498 ,  H01L23/31 ,  H01L21/56 ,  H01L21/48 ,  H01L23/00

Abstract: A semiconductor package structure includes a semiconductor die, at least one wiring structure, an encapsulant and a plurality of conductive elements. The semiconductor die has an active surface. The at least one wiring structure is electrically connected to the active surface of the semiconductor die. The encapsulant surrounds the semiconductor die. The encapsulant is formed from an encapsulating material, and a Young's Modulus of the encapsulant is from 0.001 GPa to 1 GPa. The conductive elements are embedded in the encapsulant, and are electrically connected to the at least one wiring structure.

公开(公告)号：US10304765B2

公开(公告)日：2019-05-28

申请号：US15618084

申请日：2017-06-08

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chien-Hua Chen ,  Ming-Hung Chen ,  Hsu-Chiang Shih

IPC: H01L23/04 ,  H01L23/498 ,  H01L21/48 ,  H05K1/16 ,  H01L23/538

Abstract: A semiconductor device package includes a substrate, a first insulation layer, a support film and an interconnection structure. The substrate has a first sidewall, a first surface and a second surface opposite to the first surface. The first insulation layer is on the first surface of the substrate and has a second sidewall. The first insulation layer has a first surface and a second surface adjacent to the substrate and opposite to the first surface of the first insulation layer. The support film is on the second surface of the substrate and has a third sidewall. The support film has a first surface adjacent to the substrate and a second surface opposite to the first surface of the support film. The interconnection structure extends from the first surface of the first insulation layer to the second surface of the support film via the first insulation layer and the support film. The interconnection structure covers the first, second and third sidewalls.

公开(公告)号：US12237272B2

公开(公告)日：2025-02-25

申请号：US17548333

申请日：2021-12-10

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hui-Ping Jian ,  Ming-Hung Chen ,  Jia-Feng Ho

IPC: H01L23/552 ,  H01L21/56 ,  H01L23/13 ,  H01L23/498 ,  H01Q1/22 ,  H01L23/31

Abstract: An electronic device is disclosed. The electronic device includes a carrier having a first surface and a first lateral surface, an antenna adjacent to the first surface of the carrier, and a shielding layer covering a portion of the first lateral surface of the carrier. The shielding layer is configured to allow a gain of the antenna to be greater than 20 dB.

公开(公告)号：US11302647B2

公开(公告)日：2022-04-12

申请号：US16874524

申请日：2020-05-14

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Ming-Hung Chen ,  Hui-Ping Jian ,  Wei-Zhen Qiu

IPC: H01L23/552

Abstract: The present disclosure provides for a semiconductor device package and a method for manufacturing the same. The semiconductor device package includes a substrate, a conductive element and conductive layers. The substrate has a first surface, a second surface opposite to the first surface and a lateral surface extending between the first surface and the second surface. The conductive element is disposed on the first surface of the substrate. The conductive layers have a first portion on the conductive element and a second portion on the lateral surface of the substrate. A number of layers of the first portion of the conductive layers is different from a number of layers of the second portion of the conductive layers.