公开(公告)号：US11282767B2

公开(公告)日：2022-03-22

申请号：US16717929

申请日：2019-12-17

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hsin-En Chen ,  Ian Hu ,  Jung-Che Tsai

IPC: H01L23/427 ,  H01L23/46 ,  H01L23/48 ,  H01L23/40

Abstract: A semiconductor package structure includes a package substrate and a semiconductor die. The package substrate includes a plurality of hollow vias extending through the package substrate. The semiconductor die is electrically connected to the package substrate. The hollow vias are disposed under the semiconductor die.

公开(公告)号：US11139222B2

公开(公告)日：2021-10-05

申请号：US16566502

申请日：2019-09-10

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Jung-Che Tsai ,  Ian Hu ,  Chih-Pin Hung

IPC: H01L23/427 ,  H01L23/36 ,  H01L23/00

Abstract: An electronic device includes a main substrate, a semiconductor package structure and at least one heat pipe. The semiconductor package structure is electrically connected to the main substrate, and includes a die mounting portion, a semiconductor die and a cover structure. The semiconductor die is disposed on the die mounting portion. The cover structure covers the semiconductor die. The heat pipe contacts the cover structure for dissipating a heat generated by the semiconductor die.