公开(公告)号：US20180342470A1

公开(公告)日：2018-11-29

申请号：US15603314

申请日：2017-05-23

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Kuo-Hsien LIAO ,  Alex Chi-Hong CHAN

IPC: H01L23/66 ,  H01P3/08 ,  H01Q9/04 ,  H05K1/18 ,  H01L23/552 ,  H01Q1/52 ,  H01Q13/06 ,  H01Q1/22

Abstract: The disclosure relates to a semiconductor package device. The semiconductor package device includes a substrate, a waveguide component, a package body, a first dielectric layer, an antenna pattern, and an antenna feeding layer. The waveguide component is on the substrate. The package body is on the substrate and encapsulates the waveguide component. The first dielectric layer is on the package body and has a first surface and a second surface adjacent to the package body and opposite to the first surface. The antenna pattern is on the first surface of the first dielectric layer. The antenna feeding layer is on the second surface of the first dielectric layer.

公开(公告)号：US20200185581A1

公开(公告)日：2020-06-11

申请号：US16706527

申请日：2019-12-06

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chanyuan LIU ,  Kuo-Hsien LIAO ,  Alex Chi-Hong CHAN ,  Fuh-Yuh SHIH

IPC: H01L33/60 ,  H01L33/52 ,  H01L33/62 ,  H01L25/075 ,  H01L33/00

Abstract: An optical device package includes a substrate, a light emitting device, a light detecting device, one or more electronic chips, a clear encapsulation layer and a patterned reflective layer. The substrate has a surface. The light emitting device is disposed on the surface of the substrate, the light detecting device is disposed on the surface of the substrate, and the light emitting device and the light detecting device have a gap. The one or more electronic chips are at least partially embedded in the substrate, and electrically connected to the light emitting device and the light detecting device. The clear encapsulation layer is disposed on the surface of the substrate and encapsulates the light emitting device and the light detecting device. The patterned reflective layer is disposed on an upper surface of the clear encapsulation layer and at least overlaps the gap between the light emitting device and the light detecting device in a projection direction perpendicular to the surface of the substrate.

公开(公告)号：US20230092873A1

公开(公告)日：2023-03-23

申请号：US17483720

申请日：2021-09-23

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chanyuan LIU ,  Kuo-Hsien LIAO ,  Yu-Hsiang SUN

IPC: H01L23/552 ,  H01L23/31 ,  H01L23/498

Abstract: A semiconductor device package and a fabrication method thereof are disclosed. The semiconductor package comprises: a substrate having a first face and an opposing second face, wherein the first face is mounted with a first semiconductor component and a plurality of connectors; and a first shielding member covering the first semiconductor component and a first group of the plurality of connectors, while exposing a second group of the plurality of connectors.

公开(公告)号：US20200176394A1

公开(公告)日：2020-06-04

申请号：US16694847

申请日：2019-11-25

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chanyuan LIU ,  Han-Chee YEN ,  Kuo-Hsien LIAO ,  Alex Chi-Hong CHAN ,  Christophe Zinck

IPC: H01L23/552 ,  H01L23/00 ,  H01L23/31 ,  H01L23/498 ,  H01L21/48 ,  H01L21/56

Abstract: A semiconductor package structure includes a substrate structure having a first surface and a second surface opposite to the first surface; at least two electronic components electrically connected to the first surface of the substrate structure; at least one shielding pad disposed on the first surface of the substrate structure; a plurality of vias connected to the at least one shielding pad; a plurality of shielding wirebonds disposed between the electronic components. Each of the shielding wirebonds includes a first bond and a second bond opposite to the first bond, the first bond and the second bond being electrically connected to the at least one shielding pad, and the vias being free from overlapping with any of the plurality of vias.