公开(公告)号：US20210287999A1

公开(公告)日：2021-09-16

申请号：US16817407

申请日：2020-03-12

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Fan-Yu MIN ,  Chen-Hung LEE ,  Wei-Hang TAI ,  Yuan-Tzuo LUO ,  Wen-Yuan CHUANG ,  Chun-Cheng KUO ,  Chin-Li KAO

IPC: H01L23/00 ,  H01L23/16 ,  H01L23/31 ,  H01L23/538 ,  H01L21/48 ,  H01L21/56

Abstract: A package structure and a manufacturing method are provided. The package structure includes a wiring structure, a first electronic device and a second electronic device. The first electronic device is disposed on the wiring structure. The second electronic device is disposed on the wiring structure. The first electronic device and the second electronic device are disposed side by side. A gap between the first electronic device and the second electronic device is greater than or equal to about 150 μm.

公开(公告)号：US20200294964A1

公开(公告)日：2020-09-17

申请号：US16354156

申请日：2019-03-14

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Fan-Yu MIN ,  Chao-Hung WENG ,  Wei-Hang TAI ,  Chen-Hung LEE ,  Yu-Yuan YEH

IPC: H01L25/065 ,  H01L23/00 ,  H01L23/31 ,  H01L25/00 ,  H01L21/56 ,  H01L23/538

Abstract: A semiconductor package structure includes a conductive structure, a first semiconductor chip, a second semiconductor chip, a first encapsulant and an upper semiconductor chip. The first semiconductor chip is electrically connected to the conductive structure. The first semiconductor chip includes at least one first conductive element disposed adjacent to a second surface thereof. The second semiconductor chip is electrically connected to the conductive structure and disposed next to the first semiconductor chip. The second semiconductor chip includes at least one second conductive element disposed adjacent to a second surface thereof. The first encapsulant is disposed on the conductive structure to cover the first semiconductor chip and the second semiconductor chip. The first conductive element and the second conductive element are exposed from the first encapsulant. The upper semiconductor chip is disposed on the first encapsulant and electrically connected to the first conductive element and the second conductive element.