公开(公告)号：US20180003894A1

公开(公告)日：2018-01-04

申请号：US15201095

申请日：2016-07-01

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yi-Min CHIN ,  Yung-Shun Chang ,  Mei-Ju Lu ,  Jia-Hao Zhang ,  Wen-Chi Hung

IPC: G02B6/12

CPC classification number: G02B6/12004 ,  G02B6/00 ,  G02B6/12002 ,  G02B6/122 ,  G02B6/423 ,  G02B6/4239 ,  G02B2006/12123 ,  G02B2006/12147

Abstract: A semiconductor device package includes a substrate and an optical device. The optical device includes a first portion extending into the substrate and not extending beyond a first surface of the substrate. The optical device further includes a second portion extending along the first surface of the substrate.

公开(公告)号：US10241264B2

公开(公告)日：2019-03-26

申请号：US15201095

申请日：2016-07-01

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yi-Min Chin ,  Yung-Shun Chang ,  Mei-Ju Lu ,  Jia-Hao Zhang ,  Wen-Chi Hung

IPC: G02B6/36 ,  G02B6/12

Abstract: A semiconductor device package includes a substrate and an optical device. The optical device includes a first portion extending into the substrate and not extending beyond a first surface of the substrate. The optical device further includes a second portion extending along the first surface of the substrate.