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1920 条记录 (耗时 0.027 秒)

    PLUGGABLE OPTICAL PACKING STRUCTURE
    1.
    发明公开
    PLUGGABLE OPTICAL PACKING STRUCTURE 审中-公开

    公开(公告)号：US20240353635A1

    公开(公告)日：2024-10-24

    申请号：US18207239

    申请日：2023-06-08

    申请人： FOCI FIBER OPTIC COMMUNICATIONS, INC.

    发明人： Ting-Ta Hu ,  Po-Yi Wu ,  Chieh-Yu Fang ,  Ting-Yan Lin ,  Chia-Kuo Chen

    IPC分类号： G02B6/42

    CPC分类号： G02B6/4278 ,  G02B6/423 ,  G02B6/4269

    摘要： A pluggable optical packaging structure is provided, including: a substrate, a carrier ring, at least one optical connection assembly and a cover plate; the substrate includes at least one electronic integrated circuit (EIC) and at least one photonic integrated circuit (PIC); the carrier ring is located on the substrate, and the EIC and PIC are enclosed by the carrier ring; the optical connection assembly includes at least one socket, at least one connector, a plurality of optical fibers and at least one optical fiber array connector, the socket is located in a partial section of the carrier ring, the connector is in the socket, the optical fibers has one end coupled to the connector, the other end coupled to the fiber array connector, and is coupled to the PIC through the fiber array connector; the cover plate is located on the carrier ring and extends inwardly to above the PIC.

    SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
    4.
    发明公开
    SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE 审中-公开

    公开(公告)号：US20240255714A1

    公开(公告)日：2024-08-01

    申请号：US18409730

    申请日：2024-01-10

    申请人： InnoLux Corporation

    发明人： Cheng-Chi WANG ,  Jui-Jen YUEH

    IPC分类号： G02B6/42

    CPC分类号： G02B6/423 ,  G02B6/4259 ,  G02B6/4283 ,  G02B6/4295

    摘要： The present disclosure provides a semiconductor device, including a substrate structure, a photonic unit, an optical fiber and a chip unit. The substrate structure includes a coupling member. The photonic unit is disposed in a first recess of the coupling member. The optical fiber is disposed in a second recess of the coupling member and optically coupled to the photonic unit. The chip unit is disposed on the substrate structure and electrically connected to the photonic unit through the coupling member. A depth of the second recess is greater than or equal to half a diameter of the optical fiber.

    HYBRID OPTICAL-ELECTRICAL INTERCONNECTION DEVICE
    6.
    发明公开
    HYBRID OPTICAL-ELECTRICAL INTERCONNECTION DEVICE 审中-公开

    公开(公告)号：US20240219658A1

    公开(公告)日：2024-07-04

    申请号：US18544138

    申请日：2023-12-18

    申请人： MO-LINK TECHNOLOGY LIMITED

    发明人： Hao WANG ,  Haitang QIN

    IPC分类号： G02B6/42

    CPC分类号： G02B6/423 ,  G02B6/4206 ,  G02B6/4274

    摘要： There is provided a hybrid optical-electrical interconnection device. The device may include an enclosure for providing an optical-electrical mating interface. The device may further include a securing device positioned at opposing ends of the mating interface. The device may further include a lens module positioned within the enclosure for providing the mating interface for optical-electrical signals. The lens module may include an aperture set, a lens array adjacent to the aperture set, and one or more fiber alignment cavities having grooves dimensioned to align an end of the respective one or more optical fibres with a corresponding lens of the lens array.