公开(公告)号：US20220328960A1

公开(公告)日：2022-10-13

申请号：US17225045

申请日：2021-04-07

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Jenchun CHEN ,  Ya-Wen LIAO

IPC: H01Q3/24 ,  H01Q1/22 ,  H01Q1/42

Abstract: The present disclosure provides an antenna module including a substrate, a first antenna disposed on the substrate and a second antenna disposed on the substrate and spaced apart from the first antenna. The first antenna is configured to have a first operating frequency and the second antenna is configured to have a second operating frequency different from the first operating frequency. The antenna module further includes an element configured to focus an electromagnetic wave transmitted or received by the first antenna and the second antenna. A semiconductor device package is also disclosed.

公开(公告)号：US20230086019A1

公开(公告)日：2023-03-23

申请号：US18071593

申请日：2022-11-29

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Jenchun CHEN ,  Ya-Wen LIAO

IPC: H01Q19/09 ,  H01Q3/24 ,  H01Q1/42 ,  H01Q1/22

Abstract: The present disclosure provides an antenna module including a substrate, a first antenna disposed on the substrate and a second antenna disposed on the substrate and spaced apart from the first antenna. The first antenna is configured to have a first operating frequency and the second antenna is configured to have a second operating frequency different from the first operating frequency. The antenna module further includes an element configured to focus an electromagnetic wave transmitted or received by the first antenna and the second antenna. A semiconductor device package is also disclosed.

公开(公告)号：US20240170829A1

公开(公告)日：2024-05-23

申请号：US18427788

申请日：2024-01-30

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Jenchun CHEN ,  Ya-Wen LIAO

IPC: H01Q1/22 ,  H01L23/66 ,  H01Q1/40 ,  H01Q1/42 ,  H01Q9/04 ,  H01Q21/06 ,  H01Q21/08

CPC classification number: H01Q1/2283 ,  H01L23/66 ,  H01Q1/40 ,  H01Q1/422 ,  H01Q9/0414 ,  H01Q21/065 ,  H01Q21/08 ,  H01L2223/6677 ,  H01L2223/6688

Abstract: The present disclosure provides an electronic package. The electronic package includes an antenna structure having a first antenna and a second antenna at least partially covered by the first antenna. The electronic package also includes a directing element covering the antenna structure. The directing element has a first portion configured to direct a first electromagnetic wave having a first frequency to transmit via the first antenna and a second portion configured to direct a second electromagnetic wave having a second frequency different from the first frequency to transmit via the second antenna. A method of manufacturing an electronic package is also provided.

公开(公告)号：US20240120640A1

公开(公告)日：2024-04-11

申请号：US18544377

申请日：2023-12-18

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Jenchun CHEN ,  Ya-Wen LIAO

IPC: H01Q1/22 ,  H01L23/66 ,  H01Q1/38

CPC classification number: H01Q1/2283 ,  H01L23/66 ,  H01Q1/38 ,  H01L2223/6677

Abstract: An electronic device and a method for manufacturing the same are provided. The electronic device includes a carrier, an antenna element and a cladding element. The carrier defines a first area and a second area adjacent to the first area. The antenna element is in the first area. The cladding element covers the antenna element and is configured for enhancing antenna gain of the antenna element. The second area is exposed from the cladding element and is distant from the antenna element.

公开(公告)号：US20230060538A1

公开(公告)日：2023-03-02

申请号：US17460060

申请日：2021-08-27

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Jenchun CHEN ,  Ya-Wen LIAO

IPC: H01Q1/22 ,  H01Q1/38 ,  H01L23/66

Abstract: An electronic device and a method for manufacturing the same are provided. The electronic device includes a carrier, an antenna element and a cladding element. The carrier defines a first area and a second area adjacent to the first area. The antenna element is in the first area. The cladding element covers the antenna element and is configured for enhancing antenna gain of the antenna element. The second area is exposed from the cladding element and is distant from the antenna element.

公开(公告)号：US20230037915A1

公开(公告)日：2023-02-09

申请号：US17396601

申请日：2021-08-06

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Jenchun CHEN ,  Ya-Wen LIAO

IPC: H01Q1/22 ,  H01L23/66 ,  H01Q1/42

Abstract: The present disclosure provides an electronic package. The electronic package includes an antenna structure having a first antenna and a second antenna at least partially covered by the first antenna. The electronic package also includes a directing element covering the antenna structure. The directing element has a first portion configured to direct a first electromagnetic wave having a first frequency to transmit via the first antenna and a second portion configured to direct a second electromagnetic wave having a second frequency different from the first frequency to transmit via the second antenna. A method of manufacturing an electronic package is also provided.