公开(公告)号：US12062832B2

公开(公告)日：2024-08-13

申请号：US17383403

申请日：2021-07-22

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Pei-Hsuan Lee ,  Ching-Hua Hsieh ,  Chien-Ling Hwang ,  Yu-Ting Chiu ,  Jui-Chang Kuo

IPC分类号： H01L23/66 ,  H01L21/48 ,  H01L23/00 ,  H01Q1/22 ,  H01Q1/40

CPC分类号： H01Q1/2283 ,  H01L21/4846 ,  H01L23/66 ,  H01L24/13 ,  H01L24/24 ,  H01L24/32 ,  H01L24/73 ,  H01Q1/40 ,  H01L2223/6677 ,  H01L2224/13024 ,  H01L2224/24101 ,  H01L2224/24227 ,  H01L2224/32225 ,  H01L2224/73267

摘要： A method of manufacturing an electronic device includes providing a core dielectric layer with two conductive layers formed on two opposite surfaces of the core dielectric layer, and removing at least a portion of each of the two conductive layers to respectively form an antenna pattern and a circuit pattern of a chip package at the two opposite surfaces of the core dielectric layer.

公开(公告)号：US11976950B2

公开(公告)日：2024-05-07

申请号：US17515298

申请日：2021-10-29

申请人： Beijing BOE Technology Development Co., Ltd. ,  BOE TECHNOLOGY GROUP CO., LTD.

发明人： Long Wang ,  Dongdong Zhang ,  Yafei Zhang

IPC分类号： G01D5/24 ,  H01Q1/40

CPC分类号： G01D5/24 ,  H01Q1/40

摘要： The present disclosure provides a thin film sensor, a thin film sensor array and an electronic device. The thin film sensor has a functional area and a non-functional area surrounding the functional area, and includes: a dielectric substrate having a first surface and a second surface which are oppositely arranged; a first conductive layer located on the first surface of the dielectric substrate and including a first conductive structure arranged in the functional area; a second conductive layer located on the second surface of the dielectric substrate; a first light-shielding layer located on the first surface of the dielectric substrate, the first light-shielding layer includes a first light-shielding structure at least arranged in the non-functional area, the first light-shielding structure has the same pattern as the first conductive structure.

公开(公告)号：US20240128000A1

公开(公告)日：2024-04-18

申请号：US18479190

申请日：2023-10-02

申请人： THUERINGISCHES INSTITUTE FUER TEXTILE- UND KUNSTOSTOFF-FORSCHUNG E.V.

发明人： Günther PFLUG ,  Michael GLADITZ ,  Stefan REINEMANN

IPC分类号： H01F1/34 ,  C08J3/205 ,  C08K9/04 ,  H01Q1/40

CPC分类号： H01F1/34 ,  C08J3/2053 ,  C08K9/04 ,  H01Q1/40 ,  C08J2345/00 ,  C08J2355/02 ,  C08K2201/005 ,  C08K2201/01

摘要： The invention relates to magnetodielectric polymer composites with increased refractive index and greatly reduced attenuation losses for the miniaturization of antennas in the MHz and bordering GHz frequency range, where through the use of a highly branched polymer compound in the polymer concerned, the magnetic filler component is more efficiently dispersed during processing and is also better incorporated in a 0-3 structure with the surrounding polymer matrix by virtue of the spacer function of the highly branched polymer compound.

公开(公告)号：US11949443B2

公开(公告)日：2024-04-02

申请号：US17969478

申请日：2022-10-19

申请人： Snap Inc.

发明人： Ugur Olgun

IPC分类号： H04B1/3827 ,  H01Q1/27 ,  H01Q1/40 ,  H01Q7/00 ,  H01Q9/30 ,  H04B17/21

CPC分类号： H04B1/385 ,  H01Q1/273 ,  H01Q1/40 ,  H01Q7/00 ,  H01Q9/30 ,  H04B17/21 ,  H04B2001/3866

摘要： An eyewear device that includes a lens; a support structure adapted to be worn on the head of a user, the support structure including a rim configured to support the lens in a viewing area visible to the user when wearing the support structure; an antenna embedded into or forming part of the support structure, the antenna at least partially extending into the rim; a transceiver adapter to send and receive signals; and a tuner coupled between the transceiver and the antenna, the tuner adapted to match impedance between the antenna and the transceiver to improve power transfer.

公开(公告)号：US11894314B2

公开(公告)日：2024-02-06

申请号：US17447336

申请日：2021-09-10

申请人： STATS ChipPAC Pte. Ltd.

发明人： HunTeak Lee ,  Gwang Kim ,  Junho Ye ,  YouJoung Choi ,  MinKyung Kim ,  Yongwoo Lee ,  Namgu Kim

IPC分类号： H01L23/52 ,  H01L23/552 ,  H01L23/31 ,  H01Q1/40 ,  H01L23/498 ,  H01L21/56

CPC分类号： H01L23/552 ,  H01L21/56 ,  H01L23/3128 ,  H01L23/49822 ,  H01Q1/40

摘要： A semiconductor device has a substrate and an electrical component disposed over a surface of the substrate. An antenna interposer is disposed over the substrate. A first encapsulant is deposited around the antenna interposer. The first encapsulant has a high dielectric constant. The antenna interposer has a conductive layer operating as an antenna and an insulating layer having a low dielectric constant less than the high dielectric constant of the first encapsulant. The antenna interposer is made from an antenna substrate having a plurality of antenna interposers. Bumps are formed over the antenna substrate and the antenna substrate is singulated to make the plurality of antenna interposers. A second encapsulant is deposited over the electrical component. The second encapsulant has a low dielectric constant less than the high dielectric constant of the first encapsulant. A shielding layer is disposed over the second encapsulant.

公开(公告)号：US20230420850A1

公开(公告)日：2023-12-28

申请号：US18242602

申请日：2023-09-06

申请人： The Johns Hopkins University

发明人： Matthew G. Bray

IPC分类号： H01Q9/04 ,  H01Q19/15 ,  H01Q19/13 ,  H01Q1/40 ,  H01Q21/00

CPC分类号： H01Q9/0421 ,  H01Q19/15 ,  H01Q19/13 ,  H01Q1/40 ,  H01Q21/0012

摘要： An antenna includes a waveguide defined by a gap between a backplane with radial support ribs and a facesheet, a teardrop-shaped feed pin at a center of the backplane, and a foam spacer between the backplane and facesheet. An outward facing side of the facesheet includes thermal paint. The facesheet includes pairs of through-hole slots for releasing portions of a wave of radiation in the waveguide to generate a transmit-beam or to receive the receive-beam to generate the wave of radiation. The pairs may be disposed as a spiral array about a center of the facesheet. Each of the pairs may include first and second slots. A length of the second slot is oriented approximately perpendicular to a length of the first slot. Dispositions of the slots are set by a computer process. The dispositions optimize a trade-off between transmit and receive gains.

公开(公告)号：US20230369766A1

公开(公告)日：2023-11-16

申请号：US17663489

申请日：2022-05-16

申请人： Raytheon Company

发明人： John E. Rogers

IPC分类号： H01Q9/04 ,  H01Q1/40 ,  H01Q1/52

CPC分类号： H01Q9/0435 ,  H01Q9/0471 ,  H01Q1/40 ,  H01Q1/521

摘要： Described herein is an apparatus and a method for a low-profile, circularly polarized antenna. The antenna comprises a first substrate having a first side and a second side; an antenna element on the first side of the first substrate; a first conductor on the second side of the first substrate proximity coupled to the antenna element; a second conductor on the second side of the first substrate proximity coupled to the antenna element and ±90 degrees out of phase with the first conductor; a second substrate under the first substrate having a least one air gap therein under the antenna element; a third substrate under the second substrate having a first side and a second side; and an electrical ground plane on the second side of the third substrate.

公开(公告)号：US20230335884A1

公开(公告)日：2023-10-19

申请号：US18337019

申请日：2023-06-18

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Wen-Shiang Liao

IPC分类号： H01Q1/22 ,  H01Q9/04 ,  H01Q1/48 ,  H01Q1/40

CPC分类号： H01Q1/2283 ,  H01Q9/0407 ,  H01Q1/48 ,  H01Q1/40

摘要： A semiconductor package includes a semiconductor die, an encapsulation layer and at least one antenna structure. The encapsulation layer laterally encapsulates the semiconductor die. The at least one antenna structure is embedded in the encapsulation layer aside the semiconductor die. The at least one antenna structure includes a dielectric bulk, and a dielectric constant of the dielectric bulk is higher than a dielectric constant of the encapsulation layer.

公开(公告)号：US20230275337A1

公开(公告)日：2023-08-31

申请号：US18143247

申请日：2023-05-04

申请人： SILICONWARE PRECISION INDUSTRIES CO., LTD.

发明人： Chung-Yu Ke ,  Chia-Chu Lai ,  Liang-Pin Chen

IPC分类号： H01Q1/22 ,  H01Q1/40 ,  H01L23/31 ,  H01L23/538 ,  H01L23/66 ,  H01L23/00 ,  H01L21/48 ,  H01L21/56 ,  H01L21/683 ,  H01Q1/24

CPC分类号： H01Q1/2283 ,  H01Q1/40 ,  H01L23/3128 ,  H01L23/5383 ,  H01L23/5386 ,  H01L23/5389 ,  H01L23/66 ,  H01L24/20 ,  H01L24/19 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/565 ,  H01L21/568 ,  H01L21/6835 ,  H01Q1/246 ,  H01L2224/214 ,  H01L2221/68372 ,  H01L2223/6677

摘要： An electronic package is provided and includes a first carrier structure having a plurality of antenna feed lines, and an antenna module disposed on the first carrier structure. The antenna module includes a substrate body having a plurality of recesses with different depths. Further, antenna layers are formed in the plurality of recesses and electromagnetically coupled to the antenna feed lines so as to improve the overall radiation efficiency of the antenna assembly.

公开(公告)号：US11724112B2

公开(公告)日：2023-08-15

申请号：US16951907

申请日：2020-11-18

申请人： PACESETTER, INC.

发明人： Bei Ning Zhang ,  Brett C. Villavicencio ,  Perry Li ,  Souvik Dubey

IPC分类号： A61N1/375 ,  A61N1/372 ,  A61N1/05 ,  H01Q1/40 ,  H01Q7/00

CPC分类号： A61N1/37229 ,  A61N1/0573 ,  A61N1/3756 ,  A61N1/3758 ,  A61N1/37512 ,  A61N1/37518 ,  H01Q1/40 ,  H01Q7/00

摘要： A biostimulator, such as a leadless cardiac pacemaker, having a header assembly that includes an antenna, is described. The antenna can be integrated into an insulator that separates an electrode of the header assembly from a flange of the header assembly. The antenna includes an antenna loop embedded in a ceramic material of the insulator. The antenna loop is located distal to the flange to reduce the likelihood of signal interference and increase communication range of the antenna. The header assembly is mounted on a housing have an electronics compartment, and an antenna lead extends from the antenna loop to electronic circuitry contained within the electronics compartment. Other embodiments are also described and claimed.