公开(公告)号：US11011444B2

公开(公告)日：2021-05-18

申请号：US16540837

申请日：2019-08-14

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Ya-Yu Hsieh ,  Chin-Li Kao ,  Chung-Hsuan Tsai ,  Chia-Pin Chen

IPC: H01L23/29 ,  H01L23/00 ,  H01L23/31 ,  H01L21/66

Abstract: The present disclosure provides a semiconductor package structure having a semiconductor die having an active surface, a conductive bump on the active surface, configured to electrically couple the semiconductor die to an external circuit, the conductive bump having a bump height, a dielectric encapsulating the semiconductor die and the conductive bump, and a plurality of fillers in the dielectric, each of the fillers comprising a diameter, wherein a maximum diameter of the fillers is smaller than the bump height.