公开(公告)号：US20200343336A1

公开(公告)日：2020-10-29

申请号：US16395156

申请日：2019-04-25

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Shao Hsuan CHUANG ,  Huang-Hsien CHANG ,  Min Lung HUANG ,  Yu Cheng CHEN ,  Syu-Tang LIU

IPC: H01L49/02

Abstract: The subject application relates to a semiconductor package device, which includes a first conductive layer; a semiconductor wall disposed on the first conductive layer; a first conductive wall disposed on the first conductive layer; and an insulation layer disposed on the first conductive layer and between the semiconductor wall and the first conductive wall.

公开(公告)号：US20220128768A1

公开(公告)日：2022-04-28

申请号：US17568510

申请日：2022-01-04

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Huang-Hsien CHANG ,  Po Ju WU ,  Yu Cheng CHEN ,  Wen-Long LU

IPC: G02B6/36 ,  G02B6/44 ,  G02B6/42

Abstract: An optical device package includes a semiconductor substrate, and an optical device. The semiconductor substrate has a first surface, a second surface different in elevation from the first surface, and a profile connecting the first surface to the second surface. A surface roughness of the profile is greater than a surface roughness of the second surface. The optical device is disposed on the second surface and surrounded by the profile.