公开(公告)号：US10344383B2

公开(公告)日：2019-07-09

申请号：US15668632

申请日：2017-08-03

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chuan-Yung Shih ,  Tai-Yuan Huang ,  Yu-Chi Wang ,  Chin-Feng Wang ,  Sing-Syuan Shiau ,  Chun-Wei Shih ,  Shao-Ci Huang ,  Huang-Hsien Chang ,  Yuan-Feng Chiang

IPC: H01L21/02 ,  C23C16/458 ,  H01L21/285 ,  H01L21/677 ,  H01L21/687

Abstract: In one or more embodiments, an apparatus for processing a wafer includes a ceramic wall, a metal wall and a frame. The ceramic wall defines a chamber for accommodating the wafer. The ceramic wall has a first surface defining a first opening. The metal wall surrounds the ceramic wall. The metal wall has a second surface defining a second opening adjacent to the first opening. The frame covers the second surface.