公开(公告)号：US11022464B2

公开(公告)日：2021-06-01

申请号：US16157130

申请日：2018-10-11

Applicant: Allegro MicroSystems, LLC

Inventor： Andreas P. Friedrich ,  Marie-Adelaide Lo ,  Andrea Foletto ,  Nicolas Yoakim

IPC: G01D5/16 ,  G01D5/14

Abstract: A magnetic field sensor includes one or more magnetic field sensing elements and a back-biased magnet arranged to avoid saturation of the one or more magnetic field sensing elements, particularly when the one or more magnetic field sensing elements comprise one or more magnetoresistance elements. The one or more magnetoresistance elements can be arranged in a resistor bridge.

公开(公告)号：US20190049527A1

公开(公告)日：2019-02-14

申请号：US16165464

申请日：2018-10-19

Applicant: Allegro MicroSystems, LLC

Inventor： Ravi Vig ,  William P. Taylor ,  Andreas P. Friedrich ,  Paul A. David ,  Marie-Adelaide Lo ,  Eric Burdette ,  Eric G. Shoemaker ,  Michael C. Doogue

IPC: G01R33/00 ,  G01B7/30

Abstract: A magnetic field sensor includes a lead frame, a passive component, semiconductor die supporting a magnetic field sensing element and attached to the lead frame, a non-conductive mold material enclosing the die and at least a portion of the lead frame, and a ferromagnetic mold material secured to a portion of the non-conductive mold material. The lead frame has a recessed region and the passive component is positioned in the recessed region. The ferromagnetic mold material may comprise a soft ferromagnetic material to form a concentrator or a hard ferromagnetic material to form a bias magnet.

公开(公告)号：US11828819B2

公开(公告)日：2023-11-28

申请号：US18046222

申请日：2022-10-13

Applicant: Allegro MicroSystems, LLC

Inventor： Ravi Vig ,  William P. Taylor ,  Andreas P. Friedrich ,  Paul A. David ,  Marie-Adelaide Lo ,  Eric Burdette ,  Eric G. Shoemaker ,  Michael C. Doogue

IPC: G01D5/14 ,  G01R33/07 ,  G01R15/20 ,  G01R33/00 ,  G01B7/30

CPC classification number: G01R33/0047 ,  G01B7/30 ,  G01D5/145 ,  G01R15/202 ,  G01R33/0011 ,  G01R33/072 ,  H01L2224/48247 ,  H01L2924/19105

Abstract: A magnetic field sensor includes a lead frame, a passive component, semiconductor die supporting a magnetic field sensing element and attached to the lead frame, a non-conductive mold material enclosing the die and at least a portion of the lead frame, and a ferromagnetic mold material secured to a portion of the non-conductive mold material. The lead frame has a recessed region and the passive component is positioned in the recessed region. The ferromagnetic mold material may comprise a soft ferromagnetic material to form a concentrator or a hard ferromagnetic material to form a bias magnet.

公开(公告)号：US20230057390A1

公开(公告)日：2023-02-23

申请号：US18046222

申请日：2022-10-13

Applicant: Allegro MicroSystems, LLC

Inventor： Ravi Vig ,  William P. Taylor ,  Andreas P. Friedrich ,  Paul A. David ,  Marie-Adelaide Lo ,  Eric Burdette ,  Eric G. Shoemaker ,  Michael C. Doogue

IPC: G01R33/00 ,  G01B7/30

Abstract: A magnetic field sensor includes a lead frame, a passive component, semiconductor die supporting a magnetic field sensing element and attached to the lead frame, a non-conductive mold material enclosing the die and at least a portion of the lead frame, and a ferromagnetic mold material secured to a portion of the non-conductive mold material. The lead frame has a recessed region and the passive component is positioned in the recessed region. The ferromagnetic mold material may comprise a soft ferromagnetic material to form a concentrator or a hard ferromagnetic material to form a bias magnet.