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    Sensor having protruding surface
    2.
    发明授权
    Sensor having protruding surface 有权

    公开(公告)号：US11971461B2

    公开(公告)日：2024-04-30

    申请号：US17945615

    申请日：2022-09-15

    申请人： TDK CORPORATION

    发明人： Hiromichi Umehara ,  Kenzo Makino ,  Masachika Hashino

    IPC分类号： G01R33/09 ,  G01R33/00

    CPC分类号： G01R33/093 ,  G01R33/0047

    摘要： A magnetic sensor includes an insulating layer including a protruding surface, a first MR element, and a second MR element. The protruding surface includes a first curved surface portion. The first curved surface portion includes a first portion including an upper end portion of the protruding surface, and a second portion continuous with the first portion at a position away from the upper end portion of the protruding surface. When the shape of the protruding surface is regarded as a function Z, the mean value of the absolute value of a second derivative Z″ of the function Z corresponding to the first portion is smaller than the mean value of the absolute value of the second derivative Z″ of the function Z corresponding to the second portion.

    DUAL CURRENT MAGNETIC FIELD SENSOR
    3.
    发明公开
    DUAL CURRENT MAGNETIC FIELD SENSOR 审中-公开

    公开(公告)号：US20240133981A1

    公开(公告)日：2024-04-25

    申请号：US18047759

    申请日：2022-10-18

    申请人： Infineon Technologies AG

    发明人： Stephan LEISENHEIMER ,  Richard HEINZ

    IPC分类号： G01R33/07 ,  G01R19/00 ,  G01R33/00 ,  H01L23/495

    CPC分类号： G01R33/072 ,  G01R19/0092 ,  G01R33/0005 ,  G01R33/0047 ,  G01R33/077 ,  H01L23/49503

    摘要： A current sensor arrangement includes a first conductor structure extending in a first direction and configured to carry a first current along the first direction; a second conductor structure extending in a second direction perpendicular to the first direction and configured to carry a second current along the second direction; and a magnetic field sensor arranged between the first conductor structure and the second conductor structure and configured to receive a first magnetic field produced by the first current and a second magnetic field produced by the second current. The first conductor structure and the second conductor structure overlap with the magnetic field sensor in a third direction that is perpendicular to the first and second directions. The magnetic field sensor includes a first sensor element sensitive to the first magnetic field and a second sensor element sensitive to the second magnetic field.

    MAGNETIC SENSOR
    5.
    发明公开
    MAGNETIC SENSOR 审中-公开

    公开(公告)号：US20240019504A1

    公开(公告)日：2024-01-18

    申请号：US18256351

    申请日：2021-12-06

    申请人： Panasonic Intellectual Property Management Co., Ltd.

    发明人： Takashi IMANAKA

    IPC分类号： G01R33/00 ,  G01R33/09

    CPC分类号： G01R33/0076 ,  G01R33/0047 ,  G01R33/096

    摘要： A magnetic sensor includes an insulating substrate, at least one magnetoresistive element, a conductor, and an encapsulant. The conductor electrically connects the magnetoresistive element to an external circuit. The encapsulant encapsulates not only the magnetoresistive element entirely but also the insulating substrate and the conductor at least partially. The magnetoresistive element includes a magnetoresistive film and an electrode. The magnetoresistive film is formed on a first surface of the insulating substrate. The electrode is provided on the first surface of the insulating substrate. One end of the electrode is electrically connected to the magnetoresistive film. The other end of the electrode is electrically connected to a first end portion of the conductor. The encapsulant exposes a second surface of the insulating substrate and a second end portion of the conductor from mutually different surfaces.

    Sensor
    6.
    发明授权
    Sensor 有权

    公开(公告)号：US11867779B2

    公开(公告)日：2024-01-09

    申请号：US17945397

    申请日：2022-09-15

    申请人： TDK CORPORATION

    发明人： Hiromichi Umehara ,  Keita Kawamori ,  Kenzo Makino ,  Masachika Hashino

    IPC分类号： G01R33/09 ,  G01R33/00

    CPC分类号： G01R33/093 ,  G01R33/0047

    摘要： A magnetic sensor includes an insulating layer, a first MR element, and a second MR element. The insulating layer includes a first layer and a second layer, and also includes first and second inclined surfaces formed across the first layer and the second layer. Each of the first and second MR elements includes a magnetization pinned layer and a free layer. The magnetization pinned layer and the free layer of the first MR element are disposed on the first inclined surface. The magnetization pinned layer and the free layer of the second MR element are disposed on the second inclined surface.

    ELECTRONIC DEVICE COMPRISING MAGNETIC SENSOR, AND OPERATION METHOD THEREFOR
    7.
    发明公开
    ELECTRONIC DEVICE COMPRISING MAGNETIC SENSOR, AND OPERATION METHOD THEREFOR 审中-公开

    公开(公告)号：US20240003989A1

    公开(公告)日：2024-01-04

    申请号：US18449414

    申请日：2023-08-14

    申请人： Samsung Electronics Co., Ltd.

    发明人： Taekeun KIM ,  Kihun EOM ,  Intae JUN ,  Kihoon KANG ,  Kihong MIN ,  Gunhee PARK ,  Jeonggyun PARK

    IPC分类号： G01R33/00 ,  G01R33/02

    CPC分类号： G01R33/0023 ,  G01R33/02 ,  G01R33/0047

    摘要： An electronic device may include: a magnetic sensor configured to identify the intensity of a magnetic field; a wireless communication circuit; a processor; and memory electrically connected to the magnetic sensor, the wireless communication circuit, and the processor, and storing instructions. The processor may be configured so that the electronic device: uses the magnetic sensor to identify a plurality of intensities of the magnetic field during a first period; identifies, on the basis of the plurality of intensities, whether a reference intensity has been updated; identifies a first state of the electronic device when the reference intensity has been updated, the first state being identified on the basis of a comparison result between the latest intensity among the plurality of intensities and the updated reference intensity; and performs a function according to the identified first state. Various other embodiments identified through the specification are possible.