公开(公告)号：US20190389012A1

公开(公告)日：2019-12-26

申请号：US16098367

申请日：2017-05-02

Applicant: Alpha Assembly Solutions Inc.

Inventor： Morgana De Avila Ribas ,  Suresh Telu ,  Pritha Choudhury ,  Anil K.N. Kumar ,  Siuli Sarkar

IPC: B23K35/26 ,  C22C13/02 ,  B23K1/00

Abstract: Lead-free solder alloys are described that exhibit favorable high temperature mechanical reliability and thermal fatigue resistance, and are typically capable of withstanding operational temperatures of at least 150° C., for example up to 175° C. The alloys may exhibit improved high temperature mechanical properties compared to the conventional Sn—Ag—Cu and Pb5Sn2.5Ag. The solder may be in the form of a bar, a stick, a solid or flux cored wire, a foil or strip, a film, a preform, or a powder or paste (i.e., a powder plus flux blend), or solder spheres for use in ball grid array joints or chip scale packages, or other pre-formed solder pieces, or a reflowed or solidified solder joint, or pre-applied on any solderabie material such as a copper ribbon.