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公开(公告)号：US10322471B2
公开(公告)日：2019-06-18
申请号：US15326180
申请日：2015-07-15
Applicant: Alpha Assembly Solutions Inc.
Inventor： Pritha Choudhury , Morgana De Avila Ribas , Sutapa Mukherjee , Siuli Sarkar , Ranjit Pandher , Ravindra Bhatkal , Bawa Singh
IPC: B23K31/02 , B23K35/26 , B23K35/00 , C22C13/00 , C22C13/02 , B23K1/00 , B23K1/002 , B23K1/005 , B23K1/08 , B23K35/02 , H01L23/00 , B23K101/40 , B23K101/42
Abstract: A lead-free, antimony-free solder alloy_suitable for use in electronic soldering applications. The solder alloy comprises (a) from 1 to 4 wt. % silver; (b) from 0.5 to 6 wt. % bismuth; (c) from 3.55 to 15 wt. % indium, (d) 3 wt. % or less of copper; (e) one or more optional elements and the balance tin, together with any unavoidable impurities.
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公开(公告)号：US09786629B2
公开(公告)日：2017-10-10
申请号：US14908986
申请日：2014-07-31
Applicant: Alpha Assembly Solutions Inc.
Inventor： Ramakrishna Hosur Venkatagiriyappa , Sutapa Mukherjee , Harish Hanchina Siddappa , Morgana De Avila Ribas , Siuli Sarkar , Bawa Singh , Rahul Raut
CPC classification number: H01L24/81 , H01L21/563 , H01L22/12 , H01L23/293 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/92 , H01L2224/13101 , H01L2224/13111 , H01L2224/16225 , H01L2224/2919 , H01L2224/32225 , H01L2224/73204 , H01L2224/81011 , H01L2224/81024 , H01L2224/81026 , H01L2224/81192 , H01L2224/81815 , H01L2224/81908 , H01L2224/83855 , H01L2224/92125 , H01L2924/0133 , H05K3/284 , H05K3/3436 , H05K3/3489 , H05K2201/10734 , H05K2201/10977 , H01L2924/014 , H01L2924/00014 , H01L2924/0665 , H01L2924/01029 , H01L2924/01047 , H01L2924/0105 , H01L2924/00
Abstract: Dual-side reinforcement (DSR) materials and methods for semiconductor fabrication. The DSR materials exhibit the properties of conventional underfill materials with enhanced stability at room temperature.
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公开(公告)号：US10682732B2
公开(公告)日：2020-06-16
申请号：US15562195
申请日：2016-03-31
Applicant: Alpha Assembly Solutions Inc.
Inventor： Ramakrishna Hosur Venkatagiriyappa , Morgana De Avila Ribas , Barun Das , Harish Hanchina Siddappa , Sutapa Mukherjee , Siuli Sarkar , Bawa Singh , Rahul Raut , Ranjit Pandher
IPC: C09J163/00 , C08L63/00 , C08K3/00 , C08K3/04 , C08K3/34 , C08K5/54 , C08K9/00 , B23K35/36 , B23K1/00 , B23K35/02 , H01L23/29 , H01L23/00 , C08K5/00 , C08K3/013 , B23K1/20 , C08K7/02 , B23K35/00 , C08K5/549 , B32B27/38 , B23K101/42
Abstract: A composition for use in an electronic assembly process, the composition comprising a filler dispersed in an organic medium, wherein: the organic medium comprises a polymer; the filler comprises one or more of graphene, functionalized graphene, graphene oxide, a polyhedral oligomeric silsesquioxane, graphite, a 2D material, aluminum oxide, zinc oxide, aluminum nitride, boron nitride, silver, nano fibers, carbon fibers, diamond, carbon nanotubes, silicon dioxide and metal-coated particles, and the composition comprises from 0.001 to 40 wt. % of the filler based on the total weight of the composition.
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公开(公告)号：US20190143461A9
公开(公告)日：2019-05-16
申请号：US15562195
申请日：2016-03-31
Applicant: Alpha Assembly Solutions Inc.
Inventor： Ramakrishna Hosur Venkatagiriyappa , Morgana De Avila Ribas , Barun Das , Harish Hanchina Siddappa , Sutapa Mukherjee , Siuli Sarkar , Bawa Singh , Rahul Raut , Ranjit Pandher
Abstract: A composition for use in an electronic assembly process, the composition comprising a filler dispersed in an organic medium, wherein: the organic medium comprises a polymer; the filler comprises one or more of graphene, functionalized graphene, graphene oxide, a polyhedral oligomeric silsesquioxane, graphite, a 2D material, aluminum oxide, zinc oxide, aluminum nitride, boron nitride, silver, nano fibers, carbon fibers, diamond, carbon nanotubes, silicon dioxide and metal-coated particles, and the composition comprises from 0.001 to 40 wt. % of the filler based on the total weight of the composition.
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公开(公告)号：US20230330788A1
公开(公告)日：2023-10-19
申请号：US18205590
申请日：2023-06-05
Applicant: Alpha Assembly Solutions Inc.
Inventor： Pritha Choudhury , Morgana De Avila Ribas , Sutapa Mukherjee , Anil Kumar , Siuli Sarkar , Ranjit Pandher , Ravi Bhatkal , Bawa Singh
IPC: B23K35/02 , B23K1/012 , B23K1/005 , B23K35/26 , B23K1/08 , B23K1/00 , H05K3/34 , C22C13/02 , B23K1/20 , B23K1/002 , B23K1/19 , C22C13/00
CPC classification number: B23K35/262 , B23K1/00 , B23K1/0016 , B23K1/002 , B23K1/0056 , B23K1/012 , B23K1/085 , B23K1/19 , B23K1/203 , B23K35/0222 , B23K35/0227 , B23K35/0233 , B23K35/0244 , B23K35/025 , C22C13/00 , C22C13/02 , H05K3/3457 , H05K3/3463 , B23K2103/12 , Y10T403/479
Abstract: A lead-free, antimony-free tin solder which is reliable at high temperatures and comprises from 3.5 to 4.5 wt.% of silver, 2.5 to 4 wt.% of bismuth, 0.3 to 0.8 wt.% of copper, 0.03 to 1 wt.% nickel, 0.005 to 1 wt.% germanium, and a balance of tin, together with any unavoidable impurities.
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Patent Agency Ranking
公开(公告)号：US10821557B2
公开(公告)日：2020-11-03
申请号：US16098367
申请日：2017-05-02
Applicant: Alpha Assembly Solutions Inc.
Inventor： Morgana De Avila Ribas , Suresh Telu , Pritha Choudhury , Anil K. N. Kumar , Siuli Sarkar
Abstract: Lead-free solder alloys are described that exhibit favorable high temperature mechanical reliability and thermal fatigue resistance, and are typically capable of withstanding operational temperatures of at least 150° C., for example up to 175° C. The alloys may exhibit improved high temperature mechanical properties compared to the conventional Sn—Ag—Cu and Pb5Sn2.5Ag. The solder may be in the form of a bar, a stick, a solid or flux cored wire, a foil or strip, a film, a preform, or a powder or paste (i.e., a powder plus flux blend), or solder spheres for use in ball grid array joints or chip scale packages, or other pre-formed solder pieces, or a reflowed or solidified solder joint, or pre-applied on any solderabie material such as a copper ribbon.
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公开(公告)号：US20170197281A1
公开(公告)日：2017-07-13
申请号：US15326180
申请日：2015-07-15
Applicant: ALPHA ASSEMBLY SOLUTIONS INC.
Inventor： Pritha Choudhury , Morgana De Avila Ribas , Sutapa Mukherjee , Siuli Sarkar , Ranjit Pandher , Ravindra Bhatkal , Bawa Singh
CPC classification number: B23K35/262 , B23K1/0016 , B23K1/002 , B23K1/0056 , B23K1/085 , B23K35/00 , B23K35/0222 , B23K35/0227 , B23K35/0233 , B23K35/0238 , B23K35/0244 , B23K35/025 , B23K35/26 , B23K2101/40 , B23K2101/42 , C22C13/00 , C22C13/02 , H01L24/29 , H01L24/83 , H01L2224/29101 , H01L2224/29105 , H01L2224/29109 , H01L2224/29111 , H01L2224/29113 , H01L2224/29117 , H01L2224/29123 , H01L2224/29124 , H01L2224/29138 , H01L2224/29139 , H01L2224/29144 , H01L2224/29147 , H01L2224/29149 , H01L2224/29155 , H01L2224/29157 , H01L2224/2916 , H01L2224/29163 , H01L2224/29166 , H01L2224/29169 , H01L2224/29171 , H01L2224/29172 , H01L2224/2918 , H01L2224/83815 , H01L2924/01015 , H01L2924/0102 , H01L2924/01032 , H01L2924/01034 , H01L2924/01052 , H01L2924/01058
Abstract: A lead-free, antimony-free solder alloy_suitable for use in electronic soldering applications. The solder alloy comprises (a) from 1 to 4 wt. % silver; (b) from 0.5 to 6 wt. % bismuth; (c) from 3.55 to 15 wt. % indium, (d) 3 wt. % or less of copper; (e) one or more optional elements and the balance tin, together with any unavoidable impurities.
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公开(公告)号：US11090768B2
公开(公告)日：2021-08-17
申请号：US14698450
申请日：2015-04-28
Applicant: ALPHA ASSEMBLY SOLUTIONS INC.
Inventor： Pritha Choudhury , Morgana De Avila Ribas , Sutapa Mukherjee , Anil Kumar , Siuli Sarkar , Ranjit Pandher , Ravi Bhatkal , Bawa Singh
IPC: B23K1/00 , B23K1/19 , C22C13/00 , C22C13/02 , B23K35/26 , H05K3/34 , B23K35/02 , B23K1/012 , B23K1/08 , B23K1/002 , B23K1/005 , B23K1/20 , B23K103/12
Abstract: A lead-free, antimony-free tin solder which is reliable at high temperatures and comprises up to 10 wt % Ag, up to 10 wt % Bi, up to 3 wt % Cu, other optional additives, balance tin, and unavoidable impurities.
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公开(公告)号：US20190389012A1
公开(公告)日：2019-12-26
申请号：US16098367
申请日：2017-05-02
Applicant: Alpha Assembly Solutions Inc.
Inventor： Morgana De Avila Ribas , Suresh Telu , Pritha Choudhury , Anil K.N. Kumar , Siuli Sarkar
Abstract: Lead-free solder alloys are described that exhibit favorable high temperature mechanical reliability and thermal fatigue resistance, and are typically capable of withstanding operational temperatures of at least 150° C., for example up to 175° C. The alloys may exhibit improved high temperature mechanical properties compared to the conventional Sn—Ag—Cu and Pb5Sn2.5Ag. The solder may be in the form of a bar, a stick, a solid or flux cored wire, a foil or strip, a film, a preform, or a powder or paste (i.e., a powder plus flux blend), or solder spheres for use in ball grid array joints or chip scale packages, or other pre-formed solder pieces, or a reflowed or solidified solder joint, or pre-applied on any solderabie material such as a copper ribbon.
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公开(公告)号：US20180056455A1
公开(公告)日：2018-03-01
申请号：US15562195
申请日：2016-03-31
Applicant: Alpha Assembly Solutions Inc.
Inventor： Ramakrishna Hosur Venkatagiriyappa , Morgana De Avila Ribas , Barun Das , Harish Hanchina Siddappa , Sutapa Mukherjee , Siuli Sarkar , Bawa Singh , Rahul Raut , Ranjit Pandher
Abstract: A composition for use in an electronic assembly process, the composition comprising a filler dispersed in an organic medium, wherein: the organic medium comprises a polymer; the filler comprises one or more of graphene, functionalized graphene, graphene oxide, a polyhedral oligomeric silsesquioxane, graphite, a 2D material, aluminum oxide, zinc oxide, aluminum nitride, boron nitride, silver, nano fibers, carbon fibers, diamond, carbon nanotubes, silicon dioxide and metal-coated particles, and the composition comprises from 0.001 to 40 wt. % of the filler based on the total weight of the composition.
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