公开(公告)号：US20250118715A1

公开(公告)日：2025-04-10

申请号：US18730912

申请日：2023-01-24

Applicant: Analog Devices, Inc.

Inventor： Xin Zhang ,  Jianglong Zhang ,  Li Chen ,  John C. Cowles ,  Michael Judy ,  Shafi Saiyed

IPC: H01L25/16 ,  B81B7/00 ,  H01L23/538

Abstract: Compact packages including microelectromechanical system (MEMS) devices and multiple application specific integrated circuits (ASICs) are described. These packages are sufficiently small to be applicable to contexts in which space requirements are particularly strict, such as in consumer electronics. These packages involve vertical die stacks. A first ASIC may be positioned on one side of the die stack and another ASIC may be positioned on the other side of the die stack. A die including a MEMS device (e.g., an accelerometer, gyroscope, switch, resonator, optical device) is positioned between the ASICs. Optionally, an interposer serving as cap substrate for the MEMS device is also positioned between the ASICs. In one example, a package of the types described herein has an extension of 2 mm×2 mm in the planar axes and less than 500-800 μm in height.

公开(公告)号：US20230234835A1

公开(公告)日：2023-07-27

申请号：US18100846

申请日：2023-01-24

Applicant: Analog Devices, Inc.

Inventor： Xin Zhang ,  Jianglong Zhang ,  Li Chen ,  John C. Cowles ,  Michael Judy ,  Shafi Saiyed

IPC: B81B7/00 ,  H01L23/00 ,  H01L23/498 ,  B81C1/00

CPC classification number: B81B7/0048 ,  H01L23/562 ,  H01L23/49827 ,  B81C1/00666

Abstract: Packaging of microfabricated devices, such as integrated circuits, microelectromechanical systems (MEMS), or sensor devices is described. The packaging is 3D heterogeneous packaging in at least some embodiments. The 3D heterogeneous packaging includes an interposer. The interposer includes stress relief platforms. Thus, stresses originating in the packaging do not propagate to the packaged device. A stress isolation platform is an example of a stress relief feature. A stress isolation platform includes a portion of an interposer coupled to the remainder of the interposer via stress isolation suspensions. Stress isolation suspensions can be formed by etching trenches through the interposer.