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    Low-stress packaging structure for MEMS acceleration sensor chip
    3.
    发明授权
    Low-stress packaging structure for MEMS acceleration sensor chip 有权

    公开(公告)号：US11780727B2

    公开(公告)日：2023-10-10

    申请号：US17295598

    申请日：2021-01-12

    申请人： ZHEJIANG UNIVERSITY

    发明人： Lufeng Che

    IPC分类号： B81B7/00 ,  G01P1/02 ,  B81B7/02 ,  B81C1/00 ,  G01P15/125

    CPC分类号： B81B7/0048 ,  B81B7/0045 ,  B81B7/02 ,  B81C1/00325 ,  G01P1/023 ,  G01P15/125 ,  B81B2201/0235

    摘要： A low-stress packaging structure for a MEMS acceleration sensor chip includes a MEMS sensor chip and a chip carrier. Two sides of the bottom of the sensor chip are provided with a first metal layer and a second metal layer respectively. Two sides of a die attach area of the chip carrier are correspondingly provided with a third metal layer and a fourth metal layer. The first metal layer of the sensor chip and the third metal layer of the chip carrier are bonded together. The second metal layer of the sensor chip and the fourth metal layer of the chip carrier are only in contact but not bonded. A groove is arranged between the first metal layer and the second metal layer at the bottom of the sensor chip. A certain gap is defined between the sensor chip and cavity walls of chip carrier.

    PRESSURE SENSOR
    4.
    发明申请
    PRESSURE SENSOR 审中-公开

    公开(公告)号：US20190204171A1

    公开(公告)日：2019-07-04

    申请号：US16296920

    申请日：2019-03-08

    申请人： DENSO CORPORATION

    发明人： Akira INABA ,  Minoru MURATA

    IPC分类号： G01L9/00 ,  B81B7/00

    CPC分类号： G01L9/0051 ,  B81B7/0048 ,  B81B2201/0264 ,  B81B2203/0127 ,  G01L9/00 ,  G01L13/06 ,  H01L29/84

    摘要： A pressure sensor may include a sensor chip and a support member. The sensor chip may include a diaphragm and an inner space. The diaphragm may have a thin plate shape. The diaphragm may be bent in a thickness direction by a fluid pressure. The inner space may be provided by a space adjacent to the diaphragm in the thickness direction. The support member may support the sensor chip at a position separated from the diaphragm. An outer shape of the sensor chip may be provided by a polygonal shape or a circular shape. An outer shape of the diaphragm may be provided by a polygonal shape or a circular shape.

    Pressure sensor package with stress isolation features
    6.
    发明授权
    Pressure sensor package with stress isolation features 有权

    公开(公告)号：US09963341B2

    公开(公告)日：2018-05-08

    申请号：US14716515

    申请日：2015-05-19

    申请人： Rosemount Aerospace Inc.

    发明人： David P. Potasek ,  Robert Stuelke

    IPC分类号： B81B7/00

    CPC分类号： B81B7/0058 ,  B81B7/0048 ,  B81B2207/015 ,  H01L2224/48247

    摘要： A sensor package includes a manifold and a MEMS die. The manifold includes a cylindrical body, a flange, and a mounting surface. The cylindrical body defines a first passage that extends longitudinally along a central axis from a first exterior end to an interior end of the cylindrical body. The flange extends from the cylindrical body and has an outer periphery that is configured to support a print circuit board. The mounting surface is disposed at the interior end of the first passage. The surface area of the mounting surface is less than the surface area of a MEMS die configured to mate with the mounting surface.