公开(公告)号：US20190204171A1

公开(公告)日：2019-07-04

申请号：US16296920

申请日：2019-03-08

申请人： DENSO CORPORATION

发明人： Akira INABA ,  Minoru MURATA

IPC分类号： G01L9/00 ,  B81B7/00

CPC分类号： G01L9/0051 ,  B81B7/0048 ,  B81B2201/0264 ,  B81B2203/0127 ,  G01L9/00 ,  G01L13/06 ,  H01L29/84

摘要： A pressure sensor may include a sensor chip and a support member. The sensor chip may include a diaphragm and an inner space. The diaphragm may have a thin plate shape. The diaphragm may be bent in a thickness direction by a fluid pressure. The inner space may be provided by a space adjacent to the diaphragm in the thickness direction. The support member may support the sensor chip at a position separated from the diaphragm. An outer shape of the sensor chip may be provided by a polygonal shape or a circular shape. An outer shape of the diaphragm may be provided by a polygonal shape or a circular shape.

公开(公告)号：US20180148321A1

公开(公告)日：2018-05-31

申请号：US15880332

申请日：2018-01-25

申请人： STMICROELECTRONICS S.R.L.

发明人： Enri DUQI ,  Sebastiano CONTI

IPC分类号： B81B7/00 ,  B81B3/00 ,  B81C1/00

CPC分类号： B81B7/0054 ,  B81B3/0051 ,  B81B7/0048 ,  B81B7/008 ,  B81B2201/0264 ,  B81C1/00325 ,  H01L2224/48091 ,  H01L2924/00014

摘要： A MEMS device is provided with: a supporting base, having a bottom surface in contact with an external environment; a sensor die, which is of semiconductor material and integrates a micromechanical detection structure; a sensor frame, which is arranged around the sensor die and is mechanically coupled to a top surface of the supporting base; and a cap, which is arranged above the sensor die and is mechanically coupled to a top surface of the sensor frame, a top surface of the cap being in contact with an external environment. The sensor die is mechanically decoupled from the sensor frame.

公开(公告)号：US09963341B2

公开(公告)日：2018-05-08

申请号：US14716515

申请日：2015-05-19

申请人： Rosemount Aerospace Inc.

发明人： David P. Potasek ,  Robert Stuelke

IPC分类号： B81B7/00

CPC分类号： B81B7/0058 ,  B81B7/0048 ,  B81B2207/015 ,  H01L2224/48247

摘要： A sensor package includes a manifold and a MEMS die. The manifold includes a cylindrical body, a flange, and a mounting surface. The cylindrical body defines a first passage that extends longitudinally along a central axis from a first exterior end to an interior end of the cylindrical body. The flange extends from the cylindrical body and has an outer periphery that is configured to support a print circuit board. The mounting surface is disposed at the interior end of the first passage. The surface area of the mounting surface is less than the surface area of a MEMS die configured to mate with the mounting surface.

公开(公告)号：US09926188B2

公开(公告)日：2018-03-27

申请号：US15119917

申请日：2015-02-05

申请人： Robert Bosch GmbH

发明人： Johannes Classen ,  Torsten Kramer ,  Hubert Benzel ,  Jens Frey ,  Daniel Christoph Meisel ,  Christoph Schelling

IPC分类号： H01L23/498 ,  B81B7/00 ,  B81C3/00

CPC分类号： B81B7/0048 ,  B81B2201/0264 ,  B81B2203/0127 ,  B81B2207/017 ,  B81C3/001 ,  B81C2201/0132 ,  B81C2201/019 ,  H01L2224/16225 ,  H01L2924/15311

摘要： A sensor unit including a first semiconductor component and a second semiconductor component, the first semiconductor component including a first substrate and a sensor structure. The second semiconductor component includes a second substrate, the first and second semiconductor components being connected to each other with the aid of a wafer connection, the sensor unit having a decoupling structure, which is configured in such a way that the sensor structure is decoupled thermally and/or mechanically from the second semiconductor component.

公开(公告)号：US20180016134A1

公开(公告)日：2018-01-18

申请号：US15541316

申请日：2015-11-06

申请人： TDK Corporation

发明人： Pirmin Hermann Otto Rombach

IPC分类号： B81B7/00 ,  H04R1/02 ,  H04R19/04 ,  H04R19/00

CPC分类号： B81B7/0048 ,  B81B2201/0257 ,  B81B2207/07 ,  H04R1/021 ,  H04R19/005 ,  H04R19/04 ,  H04R2201/003

摘要： A model is specified in which a MEMS component is connected to the carrier in a stress-free fashion over a large temperature range. For this purpose, a mechanical connection comprises a compensation structure which bridges a horizontal offset of mounting points by means of a horizontal shoulder and the thermal expansion coefficient of which is suitably selected.

公开(公告)号：US20170305740A1

公开(公告)日：2017-10-26

申请号：US15480015

申请日：2017-04-05

申请人： Robert Bosch GmbH

发明人： Steffen Zunft

IPC分类号： B81B7/00 ,  B81C1/00

CPC分类号： B81B7/0016 ,  B81B7/0048 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2203/0163 ,  B81B2203/0315 ,  B81C1/00333 ,  B81C2203/0109 ,  B81C2203/0118

摘要： A micromechanical device having a substrate wafer, a functional layer situated above it which has a mobile micromechanical structure, and a cap situated on top thereof, having a first cavity, which is formed at least by the substrate wafer and the cap and which includes the micromechanical structure. The micromechanical device has a fixed part and a mobile part, which are movably connected to each other with at least one spring element, and the first cavity is situated in the mobile part. Also described is a method for producing the micromechanical device.

公开(公告)号：US09790084B2

公开(公告)日：2017-10-17

申请号：US14536091

申请日：2014-11-07

申请人： Robert Bosch GmbH

发明人： Arnd Kaelberer ,  Jochen Reinmuth

IPC分类号： G01P15/00 ,  G01C19/00 ,  B81B7/00 ,  G01P15/08 ,  B81C1/00

CPC分类号： B81B7/0048 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2207/012 ,  B81B2207/096 ,  B81C1/00238 ,  B81C2203/0792 ,  G01P15/0802 ,  G01P2015/0882

摘要： A micromechanical sensor device includes an evaluation circuit formed in a first substrate, and an MEMS structure which is situated in a cavity delimited by a second substrate and a third substrate, the MEMS structure and the second substrate being situated on top of each other, the MEMS structure being functionally connected to the evaluation circuit via a contact area, the contact area between the MEMS structure and the first substrate being situated essentially centrally on the second substrate and essentially centrally on the first substrate and has an essentially punctiform configuration, proceeding radially from the contact area, a clearance being formed between the first substrate and the second substrate.

公开(公告)号：US09731958B2

公开(公告)日：2017-08-15

申请号：US15273423

申请日：2016-09-22

申请人： THALES

发明人： Fabien Filhol ,  Pierre-Olivier Lefort ,  Bertrand Leverrier ,  Régis Quer ,  Bernard Chaumet

IPC分类号： B81B7/00 ,  B81C3/00 ,  B81C1/00 ,  H01L23/10

CPC分类号： B81B7/0016 ,  B81B7/0048 ,  B81B7/0051 ,  B81B2203/0307 ,  B81C1/00269 ,  B81C3/001 ,  B81C2201/019 ,  H01L23/10

摘要： A microelectromechanical system comprising an assembly of layers stacked in a stacking direction comprises an active layer made of single-crystal silicon comprising an active structure, and first and second covers defining a cavity around the active structure, the active layer interposed between the first and second covers, the second cover comprising a single layer made of single-crystal silicon. The assembly comprises a decoupling layer made of single-crystal silicon and comprising: an attaching element fastened to a carrier, a frame encircling the attaching element in the plane of the decoupling layer, and a mechanical decoupling structure connecting the frame and the attaching structure, the mechanical decoupling structure allowing the attaching element to be flexibly joined to the frame. The frame is secured to the silicon layer of the second cover and at most one film of silicon dioxide is interposed between the frame and silicon layer of the second cover.

公开(公告)号：US20170225949A1

公开(公告)日：2017-08-10

申请号：US15497741

申请日：2017-04-26

申请人： NXP USA, Inc.

发明人： Aaron A. GEISBERGER

IPC分类号： B81C1/00

CPC分类号： B81C1/00626 ,  B81B7/0048 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2203/0307

摘要： An embodiment of a microelectromechanical systems (MEMS) device is provided, which includes a substrate; a proof mass positioned in space above a surface of the substrate, wherein the proof mass is configured to pivot on a rotational axis parallel to the substrate; an anchor structure that includes two or more separated anchors mounted to the surface of the substrate, wherein the anchor structure is aligned with the rotational axis; and an isolation sub-frame structure that surrounds the anchor structure and is flexibly connected to each of the two or more separated anchors of the anchor structure, where the proof mass is flexibly connected to the isolation sub-frame structure.

公开(公告)号：US20170223466A1

公开(公告)日：2017-08-03

申请号：US15417507

申请日：2017-01-27

申请人： Cirrus Logic International Semiconductor Ltd.

发明人： David Talmage PATTEN ,  Tsjerk Hans HOEKSTRA

IPC分类号： H04R19/04 ,  H04R19/00 ,  B81B3/00

CPC分类号： H04R19/04 ,  B81B3/0021 ,  B81B7/0048 ,  B81B2201/0257 ,  B81B2203/0118 ,  B81B2203/0127 ,  B81B2207/09 ,  H04R1/04 ,  H04R19/005 ,  H04R2201/003

摘要： A MEMS transducer (200) comprises a substrate (101) having a first surface (102) and a membrane (103) formed relative to an aperture in the substrate. The MEMS transducer (200) further comprises one or more bonding structures (107) coupled to the substrate, wherein the one or more bonding structures (107), during use, mechanically couple the MEMS transducer to an associated substrate (111). The MEMS transducer (200) comprises a sealing element (109) for providing a seal, during use, in relation to the substrate (101) and the associated substrate (111). A stress decoupling member (119) is coupled between the substrate (101) and the sealing element (109).